5SGXMA4K3F40C4WN

The 5SGXMA4K3F40C4WN is an Intel Stratix® V GX field programmable gate array (FPGA) device offering a large logic capacity and extensive I/O for complex system designs. This commercial-grade device targets applications that require substantial on-chip logic, embedded memory, and a high I/O count.

Built on the Stratix V GX family architecture, the device provides a combination of logic resources, embedded RAM, and series-level transceiver capability appropriate for designs that must integrate dense digital logic and broad external interfacing within a single FPGA package.

Key Features

• Logic Capacity — 420,000 logic elements for large-scale programmable logic implementation.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Density — 600 I/O pins to support extensive external interfacing and multi-channel connectivity.
• Transceiver Capability (series-level) — Stratix V GX devices include transceiver speed grades up to 14.1 Gbps as documented for the Stratix V GX family in the series datasheet.
• Power and Core Voltage — Core voltage supply range specified at 820 mV to 880 mV.
• Package — 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) for high-pin-count board integration.
• Temperature Grade — Commercial grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density system integration — Use the device where a large number of programmable logic resources and significant on-chip memory are required to consolidate functions into a single FPGA.
• Multi-channel I/O designs — The 600 I/O pins enable complex interfacing tasks such as multi-lane data aggregation, board-level switching, and broad peripheral connectivity.
• Custom acceleration and prototyping — Suitable for development of hardware accelerators or prototype systems that leverage large logic capacity and extensive RAM resources.

Unique Advantages

• Substantial logic resources: 420,000 logic elements reduce the need for multiple devices by enabling large designs to fit in a single FPGA.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM supports data buffering and low-latency storage without external memory for many use cases.
• High I/O count: 600 I/Os provide flexibility for complex board-level connectivity and multiple parallel interfaces.
• Commercial temperature rating: 0 °C to 85 °C operation aligns with standard commercial product requirements and deployment environments.
• RoHS compliant: Meets common environmental compliance expectations for modern electronic designs.
• FCBGA package: 1517-BBGA/1517-FBGA (40×40) packaging supports high density and reliable solder interconnects for production assemblies.

Why Choose 5SGXMA4K3F40C4WN?

The 5SGXMA4K3F40C4WN combines a large logic fabric, substantial embedded memory, and a very high I/O count in a single Stratix V GX FCBGA package, making it well suited for designs that require consolidation of complex functions and extensive external interfacing. Its commercial temperature grade and RoHS compliance make it appropriate for mainstream electronic products and development platforms.

For engineering teams and procurement professionals seeking a scalable FPGA solution from the Intel Stratix V GX family, this device provides a clear specification set—logic, memory, I/O, package, and supply voltage—that supports robust system-level planning and long-term design integration.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA4K3F40C4WN and to discuss how it can fit into your next high-density FPGA design.