5SGXMA4K3F40I3G

The 5SGXMA4K3F40I3G is a Stratix® V GX field-programmable gate array (FPGA) IC offering very high logic density and on-chip memory for complex digital designs. It combines 420,000 logic elements with approximately 37.9 Mbits of embedded memory and up to 600 I/Os to support designs that require large programmable logic resources, substantial buffering, and extensive external interfacing.

Packaged in a 1517-FBGA (40×40) surface-mount package and rated for industrial operation, this device is designed for applications that demand high integration, controlled core voltage, and wide operating temperature range.

Key Features

• Core density  420,000 logic elements to implement large FPGA designs and complex custom logic functions.
• Embedded memory  Approximately 37.9 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive algorithms.
• I/O capability  Up to 600 user I/O pins to support high-pin-count interfaces and multi-channel designs.
• Power  Core supply voltage specified at 820 mV to 880 mV to match system power-rail design requirements.
• Package and mounting  1517-BBGA / FCBGA (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Industrial grade and temperature range  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Standards compliance  RoHS compliant to meet environmental and manufacturing requirements.
• Series-level device characteristics  Device documentation for the Stratix V family includes detailed electrical and switching characteristics, including I/O timing and programmable output delays relevant to system timing and signal integrity planning.

Typical Applications

• High-density signal processing  Implement large-scale digital signal processing pipelines and custom accelerators using abundant logic and on-chip RAM.
• Multi-channel I/O systems  Support routing, aggregation, or protocol bridging for systems that require hundreds of I/O signals.
• Memory-intensive designs  Use the approximately 37.9 Mbits of embedded memory for buffering, packet processing, and deep FIFO implementations.
• Industrial control and automation  Deploy in industrial environments benefiting from the device’s industrial temperature grade and robust packaging.

Unique Advantages

• High logic capacity: 420,000 logic elements enable implementation of complex, large-scale FPGA designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces external memory dependence and lowers board-level BOM complexity.
• Large I/O count: Up to 600 I/Os simplify designs that require many peripheral connections or high channel counts.
• Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant for reliable deployment in industrial applications.
• Compact BGA package: 1517-FBGA (40×40) surface-mount package balances high pin-count and compact board footprint for dense PCBs.
• Controlled core supply: Defined core voltage range (820 mV–880 mV) supports predictable power design and thermal planning.

Why Choose 5SGXMA4K3F40I3G?

The 5SGXMA4K3F40I3G delivers a combination of high logic density, significant embedded memory, and a large I/O complement within a compact 1517-FBGA package. Its industrial temperature rating and defined core voltage range make it suitable for designs that require reliable operation across extended environments while minimizing external memory and interface components.

This device is well suited for engineering teams building complex digital systems—where integration density, predictable power requirements, and extensive I/O reduce system complexity and support scalable designs aligned with Stratix V family documentation for electrical and timing characteristics.

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