5SGXMA4K3F40I3NCV

The 5SGXMA4K3F40I3NCV is an Intel Stratix V GX field programmable gate array delivered in a 1517-BBGA FCBGA package. It provides very high logic capacity and embedded memory for complex digital designs, along with a large I/O count and an industrial temperature rating for demanding system environments.

This device targets designs that require large-scale programmable logic, significant on-chip memory, and extensive external connectivity while operating within a core voltage range of 820 mV to 880 mV.

Key Features

• Core Logic 420,000 logic elements suitable for implementing complex digital functions and large combinational/sequential logic networks.
• Embedded Memory Approximately 37.9 Mbits of on-chip RAM for buffering, FIFO, and storage of intermediate data.
• I/O Density 600 user I/Os to support wide interface requirements, multiple peripherals, and high-connectivity designs.
• Power Voltage supply range of 820 mV to 880 mV to define the device core operating window.
• Package & Mounting 1517-BBGA, FCBGA package — supplier device package listed as 1517-FBGA (40×40) — designed for surface-mount PCB assembly.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature-demanding applications.
• Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Implement large-scale custom logic and algorithm acceleration using 420,000 logic elements and substantial on-chip RAM.
• High-pin-count interface hubs — Support complex interface bridging and multi-peripheral connectivity with 600 I/Os.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and surface-mount FCBGA packaging suit embedded industrial systems.
• Memory-intensive FPGA designs — Leverage approximately 37.9 Mbits of embedded memory for buffering, packet storage, and local data processing.

Unique Advantages

• High programmable capacity: 420,000 logic elements enable the implementation of large, integrated systems on a single device, reducing BOM and board-level complexity.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM supports data-heavy designs without immediate reliance on external memory.
• Extensive external connectivity: 600 I/Os allow flexible interfacing with multiple peripherals, sensors, and high-pin-count buses.
• Industrial temperature endurance: Rated for −40 °C to 100 °C operation, supporting deployments in temperature-challenging environments.
• Compact FCBGA packaging: The 1517-BBGA package (supplier 1517-FBGA 40×40) delivers high density in a surface-mount form factor for modern PCB layouts.
• Regulatory readiness: RoHS compliance for integration into assemblies targeting environmental compliance requirements.

Why Choose 5SGXMA4K3F40I3NCV?

The 5SGXMA4K3F40I3NCV combines large-scale logic resources, significant embedded RAM, and a high I/O count in an industrial-grade Stratix V GX package. It is suited for engineers and system designers needing a programmable platform capable of consolidating complex functionality, extensive interfacing, and memory-intensive tasks in a single device.

Built on the Stratix V GX family foundation and supported by Intel device documentation, this FPGA is designed for scalable, robust implementations where integration density and thermal endurance are key selection criteria.

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