5SGXMA4K3F40I3WN

The 5SGXMA4K3F40I3WN is an industrial‑grade Stratix V GX field‑programmable gate array supplied in a 1517‑FBGA (40×40) FCBGA package for surface‑mount assembly. It delivers very high logic density and substantial on‑chip memory with a large I/O count, and is specified for operation from −40 °C to 100 °C with RoHS compliance.

Designed for applications that require large programmable logic capacity, extensive embedded RAM and numerous external interfaces, this device is suited to designs that consolidate complex logic and memory functions into a single FPGA package while meeting industrial temperature requirements.

Key Features

• Core Logic  420,000 logic elements provide a high‑density fabric for complex digital designs and extensive parallel processing.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support buffering, lookup tables and data‑intensive processing without relying solely on external memory.
• I/O Capacity  600 user I/O pins enable connectivity to multiple peripherals, interfaces and external subsystems from a single device.
• Package & Mounting  1517‑BBGA (1517‑FBGA, 40×40) FCBGA package configured for surface‑mount PCB assembly, suitable for high‑density board layouts.
• Power Supply  Core supply range specified at 820 mV to 880 mV to match system power‑rail planning and power budgeting requirements.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting deployment in thermally demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density programmable logic  Use the large logic element count to implement complex state machines, custom datapaths and parallel processing pipelines in a single FPGA.
• Memory‑intensive designs  Leverage approximately 37.9 Mbits of embedded RAM for buffering, packet queues and LUT‑based data structures without excessive external memory.
• I/O‑centric systems  Deploy in systems requiring numerous interfaces or dense peripheral connectivity using the device’s 600 I/O pins.
• Industrial equipment  Operate reliably across −40 °C to 100 °C for industrial control, instrumentation and factory automation applications.

Unique Advantages

• High integration density: 420,000 logic elements and substantial embedded RAM reduce the need for multi‑device solutions and simplify board-level system architecture.
• Large I/O count: 600 I/O pins allow consolidation of multiple interfaces and peripherals, reducing external glue logic and connectors.
• Industrial temperature capability: Rated operation to 100 °C supports deployment in demanding thermal environments without derating logic capacity.
• Compact BGA package: 1517‑FBGA (40×40) footprint provides a high‑density package option for space‑constrained PCBs while supporting surface‑mount assembly processes.
• Defined core voltage range: Core supply specified between 820 mV and 880 mV aids power‑rail design and thermal/power budgeting for complex systems.
• RoHS compliance: Conforms to common environmental requirements for lead‑free assembly.

Why Choose 5SGXMA4K3F40I3WN?

The 5SGXMA4K3F40I3WN combines high logic density, significant embedded memory and a large I/O complement in an industrial‑rated Stratix V GX FPGA package. It is targeted at designs that require consolidating advanced logic and buffering capabilities into a single, surface‑mount BGA device while maintaining operation across a wide temperature range.

For development teams and procurement organizations focused on scalable, high‑capacity FPGA solutions with clearly defined electrical and environmental specifications, this part provides a robust platform for complex, memory‑ and I/O‑intensive designs with RoHS compliance for modern production requirements.

Request a quote or submit a procurement inquiry to obtain pricing, lead‑time and availability for the 5SGXMA4K3F40I3WN.