5SGXMA4K3F40I4WN

The 5SGXMA4K3F40I4WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, provided in a 1517-BBGA FCBGA (1517-FBGA, 40×40) package. This device delivers very high logic density and significant on-chip memory, combined with a large I/O count and an industrial operating temperature range to support demanding embedded and communications designs.

Key platform-level documentation for the Stratix V family describes transceiver speed grades and device operating characteristics, enabling designers to evaluate series-level capabilities alongside the specific device-level resources listed here.

Key Features

• Logic Capacity  420,000 logic elements and 158,500 logic blocks provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O and Packaging  600 I/O pins in a 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) for dense board-level connectivity and high pin-count interfaces.
• Power  Core supply operating range of 820 mV to 880 mV, matching low-voltage FPGA core requirements.
• Thermal and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Mounting  Surface-mount package suitable for modern PCB assembly processes.
• Compliance  RoHS compliant for environmental and supply-chain requirements.
• Series-Level Transceiver Capability  Stratix V GX family documentation cites GX channel transceiver grades up to 14.1 Gbps (series-level specification); consult device documentation for grade-specific details.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory for complex FPGA-based compute, parallel processing, and custom accelerator functions.
• High-speed serial communications  Stratix V GX family transceiver grades support high-speed channel operation, making the device suitable for networking and backplane interfaces (refer to series documentation for grade-specific rates).
• Industrial control and automation  Industrial-grade temperature range (−40 °C to 100 °C) and abundant I/O enable robust control, sensor interfacing, and industrial protocol implementation.
• Board-level integration  High I/O count and compact FCBGA packaging support dense system integration where many external interfaces are required.

Unique Advantages

• High logic density: 420,000 logic elements let you consolidate complex functions into a single device and reduce BOM count.
• Large embedded memory: Approximately 37.9 Mbits of on-chip RAM helps minimize external memory needs for buffering and state storage.
• Extensive I/O capability: 600 I/O pins support wide parallel interfaces and numerous serial links without additional I/O expanders.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in harsh or controlled industrial environments.
• Compact high-pin-count package: 1517-BBGA (1517-FBGA, 40×40) delivers high connectivity in a surface-mount form factor optimized for modern PCBs.
• RoHS compliance and Intel platform documentation: Device is RoHS compliant and is covered by Stratix V family documentation for designers evaluating platform capabilities.

Why Choose 5SGXMA4K3F40I4WN?

The 5SGXMA4K3F40I4WN positions itself as a high-density Stratix V GX FPGA option for designers who need substantial logic resources, significant on-chip RAM, and a large number of I/Os in an industrial-temperature, surface-mount package. Its voltage and thermal specifications align with modern FPGA core requirements and industrial deployment needs.

This device is well suited to system designers building dense, I/O-rich systems that require integrated memory and the flexibility of FPGA-based implementation, backed by Intel's Stratix V family documentation for series-level electrical and transceiver characteristics.

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