5SGXMA5H1F35C1N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 1,421 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5H1F35C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 490,000 logic elements

The 5SGXMA5H1F35C1N is a Stratix V GX family FPGA from Intel, offering high-density programmable logic in a 1152-BBGA FCBGA package. It combines a large logic element count with substantial embedded RAM and a high I/O count for complex, integration-heavy designs.

Designed as a commercial-grade device, this FPGA targets applications that require extensive on-chip resources, flexible I/O, and a compact high-pin-count package while operating within standard commercial temperature and voltage ranges.

Key Features

  • Logic Capacity  Provides 490,000 logic elements suitable for large-scale programmable logic implementations.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for packet buffering, state storage, and intermediate data processing without immediate reliance on external memory.
  • I/O Density  552 user I/Os to support wide parallel interfaces, multiple peripherals, and high-pin-count signal routing.
  • Package & Mounting  1152-BBGA (FCBGA) supplier device package: 1152-FBGA (35×35); surface-mount mounting for compact board-level integration.
  • Power/Core Supply  Core voltage supply range from 870 mV to 930 mV to match low-voltage FPGA core rails.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and labeled as Commercial grade for standard temperature environments.
  • RoHS Compliance  RoHS compliant for regulatory and environmental considerations.

Unique Advantages

  • High logic integration: 490,000 logic elements allow implementation of complex state machines, datapaths, and parallel processing blocks on a single device.
  • Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive I/O capability: 552 I/Os enable broad interfacing options for multi-channel designs and dense connector ecosystems.
  • Compact, high-pin-count package: 1152-FBGA (35×35) FCBGA packaging delivers high I/O and signal density in a surface-mount form factor for board-space-constrained designs.
  • Low-voltage core operation: Core supply range of 870 mV to 930 mV supports integration into low-voltage system power architectures.
  • Commercial qualification and compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance support standard commercial product development and manufacturing requirements.

Why Choose 5SGXMA5H1F35C1N?

The 5SGXMA5H1F35C1N positions itself for designers needing a high-density Stratix V GX FPGA with a balance of logic capacity, embedded memory, and I/O resources in a compact FCBGA package. Its commercial-grade rating and RoHS compliance make it suitable for mainstream electronics and embedded systems within the 0 °C to 85 °C operating range.

With its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM, and 552 I/Os, this device is appropriate for complex programmable designs where on-chip integration and high I/O counts reduce board-level complexity and component count.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA5H1F35C1N.

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