5SGXMA5H1F35C2LG

The 5SGXMA5H1F35C2LG is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152‑ball FCBGA package. It provides large on‑chip logic and memory resources along with a high I/O count for dense digital system designs.

With approximately 490,000 logic elements and roughly 46.08 Mbits of embedded memory, this commercial‑grade device targets applications that require significant programmable logic capacity, substantial embedded RAM, and broad I/O connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement complex glue logic, datapaths, and custom processing functions.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM for buffering, FIFOs, and local storage of intermediate data.
• I/O Resources  552 I/O pins provide extensive external connectivity for high‑pin‑count designs and multi‑channel interfaces.
• Package & Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount FCBGA package suitable for compact, high‑density PCB layouts.
• Power Supply  Core supply specified between 820 mV and 880 mV to align with targeted power rails and system power budgeting.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Networking and Communications  Use the device where high I/O count and large programmable logic are needed to implement packet processing, protocol handling, and interface bridging.
• High‑Density Digital Systems  Deploy in systems that require significant on‑chip memory and logic capacity for custom acceleration and complex control logic.
• Data Acquisition and Instrumentation  Leverage the large logic and I/O resources for multi‑channel signal conditioning, aggregation, and pre‑processing tasks.

Unique Advantages

• Substantial Logic Capacity: Approximately 490,000 logic elements enable large, consolidated implementation of complex designs that might otherwise require multiple devices.
• Significant On‑Chip RAM: Roughly 46.08 Mbits of embedded memory reduces external memory dependence for buffering and intermediate storage, simplifying system BOM and routing.
• High Pin Count: 552 I/O pins provide flexibility for multi‑lane interfaces and extensive peripheral connections without external multiplexing.
• Compact, High‑Density Packaging: The 1152‑ball FCBGA (35×35) package supports compact PCB integration while maintaining thermal and routing considerations for dense designs.
• Commercial Temperature and RoHS Compliance: Clear specification for 0 °C to 85 °C operation and RoHS conformity for standard commercial product deployments.

Why Choose 5SGXMA5H1F35C2LG?

This Stratix V GX FPGA combines a large programmable logic fabric and substantial embedded memory with a high I/O count in a compact FCBGA package. It is well suited to engineers designing dense digital systems that require consolidation of logic, local memory, and broad external connectivity within a commercial temperature envelope.

Choosing this device supports designs that need scalability of logic resources and embedded RAM while relying on Intel’s Stratix V family architecture and documentation for system integration and validation.

Request a quote or submit an inquiry for pricing and availability for the 5SGXMA5H1F35C2LG FPGA.