5SGXMA5H1F35C2G

The 5SGXMA5H1F35C2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1152‑BBGA FCBGA package. It is a high‑density, commercial‑grade FPGA featuring substantial on‑chip logic and embedded memory for complex digital designs.

Typical uses include advanced logic integration, high‑channel I/O applications, and designs that require significant on‑chip RAM and I/O density. The device delivers a combination of large programmable logic capacity, abundant I/O, and a compact ball‑grid package for surface‑mount assembly.

Key Features

• High logic capacity — 490,000 logic elements to implement large, complex logic functions and state machines.
• Embedded memory — approximately 46 Mbits of on‑chip RAM for buffering, packet memory, and data path storage.
• Abundant I/O — 552 user I/O pins to support wide external interfacing and high port counts.
• Transceiver family (GX) — Part of the Stratix V GX family, which includes devices with GX transceiver options as defined in the Stratix V device documentation.
• Power supply — Core voltage supply specified between 870 mV and 930 mV to meet device operating requirements.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C suitable for commercial environments.
• Package and mounting — 1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), surface mount for PCB assembly.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• Networking and communications — Use the large logic and on‑chip RAM for packet processing, protocol offload, and I/O aggregation.
• High‑performance signal processing — Implement multi‑channel DSP pipelines, buffering, and complex control logic using the extensive logic elements and embedded memory.
• Data plane and acceleration — Integrate wide data paths and many external interfaces for acceleration functions that require large local RAM and many I/Os.
• Prototyping and system integration — Consolidate multiple functions into a single FPGA fabric for board‑level prototype and integration tasks that benefit from high logic density and flexible I/O.

Unique Advantages

• Large programmable fabric — 490,000 logic elements let you implement complex algorithms and deep pipelines without partitioning across multiple devices.
• Significant on‑chip memory — Approximately 46 Mbits of embedded RAM reduces external memory dependency and improves bandwidth for latency‑sensitive tasks.
• High I/O count — 552 I/Os support broad external connectivity, multi‑lane interfaces, and dense peripheral integration.
• Compact surface‑mount package — 1152‑BBGA FCBGA enables high integration density while remaining compatible with standard PCB assembly processes.
• Commercial temperature rating — Rated 0 °C to 85 °C for stable operation in commercial applications and environments.
• RoHS compliant — Environmental compliance for streamlined integration into regulated product lines.

Why Choose 5SGXMA5H1F35C2G?

The 5SGXMA5H1F35C2G delivers a balance of high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package. It is well suited for developers and system designers who need to consolidate complex digital functions, buffer large data flows on chip, and interface to many external signals within a commercial temperature range.

As a member of the Intel Stratix V GX family, this device aligns with designs that demand extensive programmable resources and flexible I/O while maintaining a commercial‑grade profile and RoHS compliance for production deployment.

Request a quote or submit your design requirements to receive pricing and availability information for 5SGXMA5H1F35C2G.