5SGXMA5H1F35C2WN

The 5SGXMA5H1F35C2WN is a Stratix V GX field programmable gate array (FPGA) IC from Intel. It delivers a high density of programmable logic and embedded memory with a large I/O complement in a compact 1152‑BBGA package.

Designed for applications that require substantial logic capacity, on‑chip RAM, and high I/O counts, this commercial‑grade device provides flexible core power operation and is RoHS compliant.

Key Features

• Logic Capacity Approximately 490,000 logic elements for implementing complex digital systems and custom hardware accelerators.
• Embedded Memory Approximately 46 Mbits of on‑chip RAM suitable for buffering, lookup tables, and intermediate data storage.
• I/O Density 552 user I/O pins to support wide parallel interfaces, multiple peripherals, and high pin‑count designs.
• Transceiver Family Characteristics Part of the Stratix V GX family; datasheet describes GX transceiver speed grades (family information included in the device documentation).
• Package 1152‑BBGA (supplier package 1152‑FBGA, 35×35 mm) surface‑mount package for high‑density board designs.
• Core Voltage Core supply operating range: 870 mV to 930 mV, enabling the device’s specified performance at rated conditions.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory RoHS compliant.

Typical Applications

• High‑density digital processing — Implement complex state machines, signal processing pipelines, and custom accelerators using abundant logic resources and embedded RAM.
• High‑I/O systems — Support wide parallel buses, multi‑lane interfaces, and many peripherals with 552 user I/Os.
• Communications and networking — Leverage Stratix V GX family transceiver capabilities (as documented in the device family datasheet) for high‑speed serial link implementations and protocol offload.

Unique Advantages

• High logic density: 490,000 logic elements enable large, integrated FPGA designs that reduce the need for multiple devices.
• Substantial on‑chip RAM: Approximately 46 Mbits of embedded memory supports buffering and on‑chip data storage, simplifying external memory requirements.
• Large I/O count: 552 I/Os provide flexibility for interfacing to numerous peripherals and parallel data paths.
• Compact BGA package: 1152‑BBGA (35×35 mm) balances high pin count with a manageable board footprint for dense system designs.
• Low‑voltage core operation: Core supply range of 870–930 mV aligns with the device’s electrical requirements and system power design.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation for typical commercial product environments.

Why Choose 5SGXMA5H1F35C2WN?

This Stratix V GX device is positioned for designs that require a combination of high logic capacity, significant embedded memory, and extensive I/O in a single FPGA package. Its core voltage range, commercial temperature rating, and family‑level transceiver characteristics (documented in the Stratix V device datasheet) make it suitable for demanding digital and communications applications.

Engineers and procurement teams looking for a high‑density FPGA solution with a compact 1152‑BBGA footprint and RoHS compliance will find the 5SGXMA5H1F35C2WN an option for consolidating complex functions and reducing overall system component count.

Request a quote or submit an inquiry to evaluate the 5SGXMA5H1F35C2WN for your next design and receive pricing and availability information tailored to your requirements.