5SGXMA5H1F35I2N

The 5SGXMA5H1F35I2N is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA / FCBGA package designed for high-density programmable logic applications. It integrates 490,000 logic elements and approximately 46 Mbits of embedded memory to support complex, memory‑intensive designs requiring large programmable logic capacity.

This device is supplied in an industrial temperature grade and is specified with a core supply range of 870 mV to 930 mV and an operating temperature range of −40°C to 100°C. The Stratix V Device Datasheet (June 2019) provides detailed electrical and switching characteristics for the Stratix V family.

Key Features

• Core & logic density 490,000 logic elements to support large-scale programmable logic implementations.
• Embedded memory Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and other memory-critical functions.
• I/O and package Up to 552 I/O pins in a high‑pincount 1152-BBGA (FCBGA) package; supplier device package specified as 1152-FBGA (35 × 35). Surface-mount mounting type simplifies board assembly.
• Voltage supply Core supply specified from 870 mV to 930 mV for predictable power-domain design.
• Temperature and grade Industrial grade device with operating temperature range −40°C to 100°C, suitable for harsh-environment deployments requiring wider temperature tolerance.
• Standards compliance RoHS compliant.
• Documentation Supported by the Stratix V Device Datasheet, which covers electrical and switching characteristics, I/O timing, and operating conditions.

Unique Advantages

• High integration density: 490,000 logic elements and ~46 Mbits of embedded memory reduce external component count for complex designs.
• Large I/O capacity: 552 I/Os enable extensive interfacing without additional bridge devices.
• Industrial temperature range: −40°C to 100°C rating supports a wide range of environmental conditions.
• Predictable power domain: Narrow core supply window (870 mV–930 mV) simplifies power-supply design and verification.
• High‑pincount packaging: 1152‑pin FCBGA footprint (35 × 35) provides the pin density required for high-bandwidth signal routing.

Why Choose 5SGXMA5H1F35I2N?

The 5SGXMA5H1F35I2N is positioned for designs that require very large programmable logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade FPGA. Its combination of 490,000 logic elements, approximately 46 Mbits of embedded RAM, 552 I/Os, and a 1152‑pin FCBGA package makes it well suited for engineering teams building dense, memory‑heavy, or I/O‑intensive programmable systems that must operate across a wide temperature range.

Backed by the Stratix V device documentation, this FPGA provides the measurable specifications engineers need to plan power, thermal, and I/O implementations with clarity and precision.

Request a quote or submit a purchase inquiry today to evaluate 5SGXMA5H1F35I2N for your next high-density FPGA design.