5SGXMA5H1F35C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 384 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5H1F35C2LN – Stratix® V GX FPGA, 490,000 logic elements, ~46 Mbits RAM, 552 I/O, 1152-BBGA
The 5SGXMA5H1F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel (Altera), offered in a 1152-BBGA (35 × 35) FCBGA package for surface-mount assembly. This commercial-grade device delivers very high logic capacity, substantial on-chip RAM, and a large I/O count for complex, programmable digital designs.
Engineered for applications that require dense programmable logic and embedded memory with large I/O connectivity, this device combines 490,000 logic elements, approximately 46 Mbits of embedded memory, and 552 I/Os in a compact BGA footprint. The device operates across a core voltage range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.
Key Features
- High Logic Density 490,000 logic elements provide substantial capacity for complex digital functions and large-scale programmable logic integration.
- On‑Chip Memory Approximately 46 Mbits of embedded memory to support buffering, packet queues, or algorithm state storage without external RAM.
- Extensive I/O 552 dedicated I/O pins enable broad interfacing options for parallel buses, high‑pin-count connectors, and multi‑lane I/O requirements.
- Package and Mounting 1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA (35×35), designed for surface-mount PCB assembly where a dense ball-grid footprint is required.
- Low-Voltage Core Core supply range of 820 mV to 880 mV for operation within defined power rails and board power architectures.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial-temperature environments.
- Family Transceiver Capability (Series Data) The Stratix V GX family includes transceiver speed grades that can support multi-gigabit channel rates as described in the series datasheet.
- RoHS Compliant Device is RoHS compliant for environmental and lead‑free assembly requirements.
Typical Applications
- High‑density programmable logic Implement large state machines, custom datapaths, and complex control logic using the device's 490,000 logic elements.
- Memory‑heavy on‑chip processing Use approximately 46 Mbits of embedded RAM for buffering, temporary data storage, or algorithm acceleration without heavy external memory dependence.
- High‑pin-count interfacing Leverage 552 I/Os to connect to multiple peripherals, parallel interfaces, or board-level connectors requiring many signals.
- Compact, high‑density PCB designs The 1152‑BBGA package enables dense routing and compact board layouts where a small footprint with many balls is required.
- Commercial embedded systems Suitable for commercial-temperature products and development platforms that require substantial programmable logic and I/O capacity.
Unique Advantages
- Massive programmable capacity: 490,000 logic elements allow integration of multiple functions and complex designs into a single device, reducing external component count.
- Significant embedded RAM: Approximately 46 Mbits of on‑chip memory enables local data storage for high-throughput and latency-sensitive operations.
- High I/O scalability: 552 I/O pins provide flexibility to support dense interfaces and multi-channel designs without immediate need for external expanders.
- Dense BGA packaging: The 1152‑BBGA (35×35) footprint balances ball count and board area to support high-pin designs in compact form factors.
- Designed for standard commercial environments: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployments.
- Series transceiver options: Stratix V GX family transceiver speed grades are documented in the series datasheet for designers evaluating multi‑gigabit channel support.
Why Choose 5SGXMA5H1F35C2LN?
The 5SGXMA5H1F35C2LN delivers a combination of very high logic density, substantial embedded memory, and extensive I/O in a single commercial‑grade Stratix V GX FPGA. These characteristics make it suitable for designs that consolidate multiple digital functions, require large on‑chip RAM, or demand many external connections while maintaining a compact board footprint.
Choosing this device provides a scalable platform within the Stratix V GX series, enabling designers to leverage series-level transceiver capabilities and an established FPGA architecture while meeting commercial temperature and RoHS requirements.
Request a quote or submit a purchase inquiry to get pricing and availability information for 5SGXMA5H1F35C2LN. Our team can provide lead‑time details and help match this device to your design requirements.

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