5SGXMA5H1F35C2LN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 384 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5H1F35C2LN – Stratix® V GX FPGA, 490,000 logic elements, ~46 Mbits RAM, 552 I/O, 1152-BBGA

The 5SGXMA5H1F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel (Altera), offered in a 1152-BBGA (35 × 35) FCBGA package for surface-mount assembly. This commercial-grade device delivers very high logic capacity, substantial on-chip RAM, and a large I/O count for complex, programmable digital designs.

Engineered for applications that require dense programmable logic and embedded memory with large I/O connectivity, this device combines 490,000 logic elements, approximately 46 Mbits of embedded memory, and 552 I/Os in a compact BGA footprint. The device operates across a core voltage range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • High Logic Density  490,000 logic elements provide substantial capacity for complex digital functions and large-scale programmable logic integration.
  • On‑Chip Memory  Approximately 46 Mbits of embedded memory to support buffering, packet queues, or algorithm state storage without external RAM.
  • Extensive I/O  552 dedicated I/O pins enable broad interfacing options for parallel buses, high‑pin-count connectors, and multi‑lane I/O requirements.
  • Package and Mounting  1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA (35×35), designed for surface-mount PCB assembly where a dense ball-grid footprint is required.
  • Low-Voltage Core  Core supply range of 820 mV to 880 mV for operation within defined power rails and board power architectures.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-temperature environments.
  • Family Transceiver Capability (Series Data)  The Stratix V GX family includes transceiver speed grades that can support multi-gigabit channel rates as described in the series datasheet.
  • RoHS Compliant  Device is RoHS compliant for environmental and lead‑free assembly requirements.

Typical Applications

  • High‑density programmable logic  Implement large state machines, custom datapaths, and complex control logic using the device's 490,000 logic elements.
  • Memory‑heavy on‑chip processing  Use approximately 46 Mbits of embedded RAM for buffering, temporary data storage, or algorithm acceleration without heavy external memory dependence.
  • High‑pin-count interfacing  Leverage 552 I/Os to connect to multiple peripherals, parallel interfaces, or board-level connectors requiring many signals.
  • Compact, high‑density PCB designs  The 1152‑BBGA package enables dense routing and compact board layouts where a small footprint with many balls is required.
  • Commercial embedded systems  Suitable for commercial-temperature products and development platforms that require substantial programmable logic and I/O capacity.

Unique Advantages

  • Massive programmable capacity: 490,000 logic elements allow integration of multiple functions and complex designs into a single device, reducing external component count.
  • Significant embedded RAM: Approximately 46 Mbits of on‑chip memory enables local data storage for high-throughput and latency-sensitive operations.
  • High I/O scalability: 552 I/O pins provide flexibility to support dense interfaces and multi-channel designs without immediate need for external expanders.
  • Dense BGA packaging: The 1152‑BBGA (35×35) footprint balances ball count and board area to support high-pin designs in compact form factors.
  • Designed for standard commercial environments: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployments.
  • Series transceiver options: Stratix V GX family transceiver speed grades are documented in the series datasheet for designers evaluating multi‑gigabit channel support.

Why Choose 5SGXMA5H1F35C2LN?

The 5SGXMA5H1F35C2LN delivers a combination of very high logic density, substantial embedded memory, and extensive I/O in a single commercial‑grade Stratix V GX FPGA. These characteristics make it suitable for designs that consolidate multiple digital functions, require large on‑chip RAM, or demand many external connections while maintaining a compact board footprint.

Choosing this device provides a scalable platform within the Stratix V GX series, enabling designers to leverage series-level transceiver capabilities and an established FPGA architecture while meeting commercial temperature and RoHS requirements.

Request a quote or submit a purchase inquiry to get pricing and availability information for 5SGXMA5H1F35C2LN. Our team can provide lead‑time details and help match this device to your design requirements.

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