5SGXMA5H1F35I2G

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 771 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5H1F35I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA5H1F35I2G is a Stratix V GX family FPGA offering high-density programmable logic and substantial on-chip memory for industrial and commercial designs. It provides approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 552 I/O pins in a surface-mount FCBGA package.

Engineered for demanding applications that require large logic capacity and extensive I/O, this device is supplied in an industrial temperature grade and supports core voltage operation from 870 mV to 930 mV.

Key Features

  • High Logic Density  Approximately 490,000 logic elements (cells) to implement large, complex programmable logic designs.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for large data buffers, state machines, and memory-intensive logic functions.
  • Extensive I/O  552 I/O pins provide broad connectivity for interfaces, peripherals, and board-level routing needs.
  • Voltage Supply  Specified operating supply range from 870 mV to 930 mV to match system power architectures.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployments in temperature-demanding environments.
  • Package & Mounting  1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35).
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.
  • Family Transceiver Options  As a Stratix V GX device, the family is offered with transceiver speed grade options (refer to device documentation for details).

Unique Advantages

  • Large programmable fabric: Enables consolidation of multiple functions into a single device, reducing board-level component count.
  • Significant on-chip RAM: Approximately 46 Mbits of embedded memory supports deep buffering and memory-heavy algorithms without external memory.
  • High I/O capacity: 552 I/Os allow flexible interfacing with peripherals, sensors, and high-pin-count connectors.
  • Industrial temperature support: Rated –40 °C to 100 °C for use in environments requiring extended temperature tolerance.
  • Compact FCBGA package: 1152-ball FCBGA (35×35) provides a compact form factor for high-density designs.
  • Standards-conscious manufacturing: RoHS compliance supports regulated product builds.

Why Choose 5SGXMA5H1F35I2G?

The 5SGXMA5H1F35I2G combines substantial logic capacity, large embedded memory, and a high I/O count in an industrial-grade Stratix V GX device. It is well suited to designs that require dense programmable logic, on-chip memory resources, and robust thermal performance.

For engineering teams seeking a high-density FPGA in a compact FCBGA package, this device offers a balance of integration and specification-driven performance, backed by the Stratix V family documentation and product definitions.

Request a quote or submit an inquiry to receive pricing, availability, or additional technical information for the 5SGXMA5H1F35I2G.

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