5SGXMA5H1F35I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 771 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5H1F35I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA5H1F35I2G is a Stratix V GX family FPGA offering high-density programmable logic and substantial on-chip memory for industrial and commercial designs. It provides approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 552 I/O pins in a surface-mount FCBGA package.
Engineered for demanding applications that require large logic capacity and extensive I/O, this device is supplied in an industrial temperature grade and supports core voltage operation from 870 mV to 930 mV.
Key Features
- High Logic Density Approximately 490,000 logic elements (cells) to implement large, complex programmable logic designs.
- Embedded Memory Approximately 46 Mbits of on-chip RAM for large data buffers, state machines, and memory-intensive logic functions.
- Extensive I/O 552 I/O pins provide broad connectivity for interfaces, peripherals, and board-level routing needs.
- Voltage Supply Specified operating supply range from 870 mV to 930 mV to match system power architectures.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for deployments in temperature-demanding environments.
- Package & Mounting 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35).
- RoHS Compliant Manufactured in compliance with RoHS requirements.
- Family Transceiver Options As a Stratix V GX device, the family is offered with transceiver speed grade options (refer to device documentation for details).
Unique Advantages
- Large programmable fabric: Enables consolidation of multiple functions into a single device, reducing board-level component count.
- Significant on-chip RAM: Approximately 46 Mbits of embedded memory supports deep buffering and memory-heavy algorithms without external memory.
- High I/O capacity: 552 I/Os allow flexible interfacing with peripherals, sensors, and high-pin-count connectors.
- Industrial temperature support: Rated –40 °C to 100 °C for use in environments requiring extended temperature tolerance.
- Compact FCBGA package: 1152-ball FCBGA (35×35) provides a compact form factor for high-density designs.
- Standards-conscious manufacturing: RoHS compliance supports regulated product builds.
Why Choose 5SGXMA5H1F35I2G?
The 5SGXMA5H1F35I2G combines substantial logic capacity, large embedded memory, and a high I/O count in an industrial-grade Stratix V GX device. It is well suited to designs that require dense programmable logic, on-chip memory resources, and robust thermal performance.
For engineering teams seeking a high-density FPGA in a compact FCBGA package, this device offers a balance of integration and specification-driven performance, backed by the Stratix V family documentation and product definitions.
Request a quote or submit an inquiry to receive pricing, availability, or additional technical information for the 5SGXMA5H1F35I2G.

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