5SGXMA5H2F35C1N

The 5SGXMA5H2F35C1N is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1152-BBGA (FCBGA) package. It provides very large programmable logic capacity combined with substantial embedded memory and a high I/O count for complex, I/O‑intensive digital designs.

With approximately 490,000 logic elements and approximately 46 Mbits of embedded memory, this commercial‑grade device is suited for designs that require high logic density, significant on‑chip RAM, and a compact surface‑mount package. The device operates from a 0.87 V to 0.93 V core supply and is rated for 0 °C to 85 °C operation.

Key Features

• Core Logic Capacity  Approximately 490,000 logic elements and 185,000 logic array blocks, enabling complex programmable logic implementations.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for large buffer, cache, or scratchpad requirements.
• I/O Density  552 user I/O pins to support high‑pin‑count interfaces and multi‑channel connectivity.
• Package and Mounting  1152‑BBGA (FCBGA) supplier device package: 1152‑FBGA (35×35). Surface‑mount package suitable for compact board layouts.
• Power and Supply  Core voltage supply range: 870 mV to 930 mV, allowing precise core power management in system power architectures.
• Temperature and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental  RoHS compliant.
• Family and Documentation  Device belongs to the Stratix V GX family; refer to the Stratix V device datasheet for series‑level electrical characteristics and transceiver options.

Typical Applications

• High‑density digital systems  Use the large logic capacity and embedded memory to implement complex custom processing, packet processing, or algorithm acceleration.
• I/O‑intensive interfaces  Leverage 552 I/Os to connect multiple high‑pin‑count peripherals, parallel buses, or multi‑lane front‑end interfaces.
• On‑chip buffering and dataflow  Approximately 46 Mbits of embedded RAM supports large FIFOs, frame buffers, and intermediate data storage without external memory for certain use cases.
• Compact board designs  The 1152‑BBGA (35×35) surface‑mount package helps pack high functionality into space‑constrained PCBs.

Unique Advantages

• High logic integration: Approximately 490,000 logic elements reduce the need for multi‑device partitioning in large designs.
• Substantial on‑chip memory: Roughly 46 Mbits of embedded RAM enables large internal buffers and lowers reliance on external memory for many applications.
• Extensive I/O: 552 I/Os provide flexibility to support many parallel interfaces, signaling standards, and system expansion.
• Compact FCBGA packaging: 1152‑FBGA (35×35) package concentrates I/O and logic in a small footprint for dense system implementations.
• Controlled core supply range: 870 mV–930 mV core voltage range supports precise power budgeting and integration with system power rails.
• Regulatory readiness: RoHS compliance helps streamline environmental compliance for global product programs.

Why Choose 5SGXMA5H2F35C1N?

The 5SGXMA5H2F35C1N provides a high‑capacity Stratix V GX FPGA option for designers who need large programmable logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. Its commercial temperature rating and controlled core voltage range make it suitable for demanding board‑level applications where density and integration matter.

This device is appropriate for development teams and OEMs targeting systems that benefit from extensive on‑chip resources and a high pin count without moving to multi‑device solutions. Series documentation for Stratix V GX devices is available for designers seeking detailed electrical characteristics and series‑level configuration options.

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