5SGXMA5H2F35C2G

The 5SGXMA5H2F35C2G is a Stratix V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package by Intel. It provides a large programmable fabric, substantial on-chip memory, and a high general-purpose I/O count for commercial-grade designs.

Designed for commercial temperature operation, this device combines approximately 490,000 logic elements with approximately 46 Mbits of embedded memory and 552 I/O pins to support dense logic, memory buffering, and heavy I/O aggregation in a surface-mount ball-grid array package.

Key Features

• Core Architecture Stratix V GX FPGA architecture in the 5SGXMA5H2F35C2G model, providing a large programmable logic fabric for complex logic implementation.
• Logic Capacity Approximately 490,000 logic elements to implement high‑density logic and custom datapath functions.
• On-Chip Memory Approximately 46 Mbits of embedded memory for buffering, FIFOs, and mid-level storage inside the FPGA fabric.
• High I/O Count 552 user I/O pins to support extensive interfacing and parallel connectivity to external devices and subsystems.
• Power Core voltage supply rated at 870 mV–930 mV to match specified device operating conditions.
• Package & Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) in a surface-mount form factor for compact board integration.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
• Regulatory RoHS compliant.

Typical Applications

• Complex programmable logic integration — Use where designs require up to approximately 490,000 logic elements and substantial on-chip memory for custom logic and datapath implementation.
• High-density I/O aggregation — Suitable for systems that need a large number of general-purpose I/O signals (552 I/Os) in a compact FCBGA package.
• Commercial electronic systems — Targeted at commercial temperature grade applications operating between 0 °C and 85 °C that require a high-capacity FPGA.

Unique Advantages

• Large programmable fabric: Approximately 490,000 logic elements enable implementation of complex state machines, parallel datapaths, and custom accelerators on a single device.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependence on external memory for mid-level buffering and local storage.
• Extensive I/O capability: 552 I/Os provide flexibility for wide parallel buses, multiple interfaces, and dense external connectivity.
• Compact surface-mount package: 1152-BBGA (FCBGA) packaging with a 1152-FBGA supplier footprint supports compact PCB designs while keeping high pin count.
• Commercial temperature rating: Designed and specified for 0 °C to 85 °C operation to match commercial system requirements.
• RoHS compliant: Meets RoHS requirements for environmentally conscious product builds.

Why Choose 5SGXMA5H2F35C2G?

The 5SGXMA5H2F35C2G offers a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a compact FCBGA package—delivering integration density for commercial FPGA designs. Its specification-aligned voltage and temperature ranges make it suitable for systems that require commercial-grade programmable logic with significant on-chip resources.

This device is appropriate for engineering teams and procurement seeking a high-capacity Stratix V GX FPGA from Intel with verifiable specifications for logic elements, memory, I/O, package, and operating conditions.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGXMA5H2F35C2G.