5SGXMA5H2F35C2WN

The 5SGXMA5H2F35C2WN is a Stratix® V GX family FPGA in a 1152‑BBGA (35×35) surface‑mount package, offered in a commercial temperature grade. It delivers large on‑chip logic and memory resources together with a high I/O count for dense, compute‑and I/O‑intensive designs.

Targeted at applications that require substantial programmable logic, extensive embedded RAM, and broad interfacing capability, this device provides designers with integration and scalability for complex digital systems while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements for implementing large-scale digital designs and custom accelerators.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, large state machines, and data paths without external memory for many use cases.
• I/O Density  552 available I/O pins to support wide bus interfaces, multiple peripherals, and high‑pincount system integration.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35); surface mount for standard PCB assembly processes.
• Power Supply  Device core supply range from 870 mV to 930 mV for defined core voltage design and power planning.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for typical commercial environment deployments.
• Compliance  RoHS compliant to support regulatory and assembly requirements.

Typical Applications

• High‑density digital systems  Large programmable logic capacity enables implementation of complex state machines, digital signal processing, and custom compute blocks.
• High‑I/O interface hubs  The 552 I/O count supports bridging, protocol translation, and multi‑channel peripheral aggregation in embedded platforms.
• On‑chip memory‑centric designs  Approximately 46 Mbits of embedded memory is suitable for packet buffering, frame storage, and intermediate data staging without immediate reliance on external RAM.

Unique Advantages

• Large programmable fabric: 490,000 logic elements provide the scale required to consolidate multiple functions into a single device, reducing system complexity.
• Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM enables many memory‑heavy algorithms to run without external memory, simplifying BOM and board layout.
• High I/O capacity: 552 I/O pins support extensive peripheral connectivity and high‑bandwidth interfaces directly at the FPGA package.
• Standard surface‑mount package: 1152‑BBGA (35×35) allows integration into conventional PCB manufacturing flows for production scalability.
• Commercial grade: Rated 0 °C to 85 °C to match typical enterprise, communications, and industrialized commercial applications.
• Regulatory readiness: RoHS compliance helps meet environmental and assembly requirements for modern product lines.

Why Choose 5SGXMA5H2F35C2WN?

The 5SGXMA5H2F35C2WN brings together a high count of logic elements, large on‑chip RAM, and a significant I/O footprint in a single commercial‑grade Stratix® V GX device and standard 1152‑BBGA package. It is well suited for designers who need to integrate complex logic, substantial buffering or memory resources, and broad interfacing on a single FPGA to reduce system complexity and board-level interconnect.

Choosing this device supports projects that prioritize integration and predictable operational parameters (core voltage and temperature range), while benefiting from the Stratix® V GX family characteristics documented in the device datasheet.

Request a quote or submit a sales inquiry to evaluate 5SGXMA5H2F35C2WN for your next design project and get pricing and availability information tailored to your requirements.