5SGXMA5H2F35C3N

The 5SGXMA5H2F35C3N is a Stratix® V GX field programmable gate array (FPGA) in a 1152-pin FBGA package. It provides a large logic fabric, substantial on-chip memory, and a high I/O count for designs that require dense programmable logic and significant embedded RAM.

Designed for commercial-grade applications, the device operates from an 820 mV to 880 mV core supply and across a 0°C to 85°C temperature range, offering a balance of integration density and predictable operating conditions for complex digital systems.

Key Features

• Logic Capacity — 490,000 logic elements suitable for large-scale programmable designs and complex logic implementations.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support data buffering, state retention, and memory-intensive logic blocks.
• I/O Density — 552 I/Os providing ample external connectivity for parallel interfaces, multi-channel I/O, and board-level integration.
• Transceiver Capabilities (Series) — Stratix V GX devices in the family support GX transceiver speed grades up to 14.1 Gbps, enabling high-speed serial connectivity where applicable.
• Power — Core voltage supply range of 820 mV to 880 mV for the device core.
• Package and Mounting — 1152-FBGA (35×35) package; surface-mount mounting type for standard PCB assembly.
• Commercial Temperature Grade — Rated for operation from 0°C to 85°C.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• High-speed serial connectivity: Use family transceiver capability to implement multi-gigabit links and SerDes channels where high data-rate lanes are required.
• High-density logic systems: Leverage 490,000 logic elements and large embedded memory for complex control, data-path, and state-machine implementations.
• Multi-interface integration: 552 I/Os allow aggregation of parallel and serial interfaces, board-level bridging, and flexible peripheral connectivity.
• Prototyping and system integration: The device’s capacity and I/O count support integration of extensive IP blocks and system-level prototypes for verification and validation.

Unique Advantages

• High logic density: 490,000 logic elements reduce the need for multiple devices, simplifying board design and reducing BOM complexity.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM enables local data buffering and accelerates memory-bound operations without external RAM.
• Extensive I/O resources: 552 I/Os provide flexibility for connecting multiple peripherals, parallel buses, and high-pin-count interfaces directly to the FPGA.
• Commercial temperature rating: Specified operation from 0°C to 85°C for deployment in standard commercial environments.
• RoHS compliance: Meets environmental requirements for regulated markets and designs.
• Standard surface-mount package: 1152-FBGA (35×35) supports industry-standard PCB assembly processes.

Why Choose 5SGXMA5H2F35C3N?

This Stratix V GX FPGA part combines a very large logic fabric with substantial embedded memory and a high I/O count, making it well suited for commercial designs that demand on-chip capacity and flexible connectivity. The device’s package density and surface-mount form factor simplify board-level integration while providing the headroom needed for complex system functions.

Choose 5SGXMA5H2F35C3N for projects that require scalable programmable logic, significant local memory, and wide I/O capability in a commercial-temperature FPGA offering with RoHS compliance.

Request a quote or submit an inquiry to check pricing, availability, and lead times for 5SGXMA5H2F35C3N. Our team can provide technical details and support to help evaluate this device for your design.