5SGXMA5H2F35C2LN

The 5SGXMA5H2F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) in a high‑density 1152‑FBGA (35×35) surface‑mount package. It delivers large programmable logic capacity, substantial on‑chip memory, and a high I/O count for designs that require extensive logic integration and signal connectivity.

Targeted at commercial‑grade applications, this device combines 490,000 logic elements with approximately 46 Mbits of embedded memory and up to 552 I/O pins, providing a platform for complex digital systems with demanding logic and memory requirements while operating within a 0 °C to 85 °C temperature range and a core supply of 0.820–0.880 V.

Key Features

• Core Logic  490,000 logic elements (cells) to implement large, complex programmable logic designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, look‑up tables, and data storage within the FPGA fabric.
• I/O Density  Up to 552 general‑purpose I/O pins to support extensive external interfaces and board‑level connectivity.
• Package  1152‑BBGA FCBGA (1152‑FBGA, 35×35) surface‑mount package for high‑density board integration.
• Power Supply  Core voltage supply range of 0.820 V to 0.880 V to match system power rails and design constraints.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial‑grade deployments.
• RoHS Compliant  Manufactured in accordance with RoHS requirements.

Typical Applications

• High‑density digital systems  Implement large-scale programmable logic where hundreds of thousands of logic elements are required for custom algorithms and control logic.
• Memory‑intensive designs  Use on‑chip RAM to support buffering, packet processing, or state storage without immediate external memory dependency.
• I/O‑centric platforms  Integrate with multiple peripherals and high‑pin‑count interfaces using the device’s 552 I/O pins for system expansion and signal routing.

Unique Advantages

• Large programmable capacity: 490,000 logic elements enable implementation of extensive logic functions and complex datapaths on a single device.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces the need for external memory in many buffering and storage use cases.
• High I/O count: 552 I/O pins simplify board routing for multi‑interface and high‑connectivity designs.
• High‑density package: 1152‑FBGA (35×35) package offers a compact footprint for high‑pin‑count FPGA integration on space‑constrained PCBs.
• Commercial temperature rating and RoHS compliance: Designed for commercial environments with recognized environmental compliance.
• Surface‑mount mounting: Enables standard PCB assembly processes for modern electronics manufacturing.

Why Choose 5SGXMA5H2F35C2LN?

The 5SGXMA5H2F35C2LN positions itself as a high‑capacity Stratix V GX FPGA optimized for commercial‑grade designs that demand abundant logic, embedded memory, and I/O resources in a compact BGA package. Its combination of 490,000 logic elements, approximately 46 Mbits of on‑chip RAM, and 552 I/O pins makes it well suited to complex, high‑integration projects where consolidating functionality into a single FPGA reduces system complexity.

For development teams and procurement focused on scalable, resource‑rich FPGA solutions, this device delivers a platform that balances programmable capacity, I/O density, and package integration while adhering to commercial temperature and RoHS requirements.

Request a quote or submit a sales inquiry to evaluate 5SGXMA5H2F35C2LN for your next high‑density FPGA design project.