5SGXMA5H2F35C2LG

The 5SGXMA5H2F35C2LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, delivered in a high‑density 1152‑BBGA FCBGA package. It provides a large programmable fabric—approximately 490,000 logic elements—and substantial on‑chip memory to support complex, logic‑intensive designs.

Built for commercial temperature operation, this device targets FPGA applications that require high logic capacity, extensive embedded memory, and a high I/O count within a compact surface‑mount package.

Key Features

• High Logic Capacity — Approximately 490,000 logic elements to implement complex digital systems and deep logic networks.
• Embedded Memory — Approximately 46 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• Large I/O Count — 552 user I/O pins to support multi‑lane interfaces and dense peripheral connectivity.
• Package — 1152‑BBGA, FCBGA package; supplier device package listed as 1152‑FBGA (35 × 35 mm) for compact board integration.
• Power and Voltage — Core voltage supply range of 820 mV to 880 mV for the device core power rails.
• Operating Conditions — Commercial grade operation with an ambient temperature range of 0 °C to 85 °C and surface‑mount mounting type.
• Standards Compliance — RoHS compliant for environmental and regulatory compatibility.
• Family‑Level Documentation — Datasheet and electrical/switching characteristic guidance available for the Stratix V family, including transceiver and I/O timing details.

Typical Applications

• High‑density digital systems — Leverage the large logic element count and embedded RAM for complex FPGA algorithms and control logic.
• Data buffering and packet processing — On‑chip memory supports packet queues, FIFOs, and intermediate buffering in throughput‑intensive designs.
• Multi‑lane interface and peripheral aggregation — High I/O count enables aggregation of multiple serial/parallel interfaces and sensor or peripheral connections.

Unique Advantages

• Substantial programmable fabric: Large logic element capacity enables integration of multiple functions on a single device, reducing system BOM.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM supports local data storage and reduces external memory dependency.
• Dense I/O support: 552 I/O pins accommodate complex connectivity requirements without additional I/O expansion.
• Compact, manufacturable package: 1152‑BBGA FCBGA in a supplier 1152‑FBGA (35 × 35 mm) footprint suits high‑density PCB layouts and surface‑mount assembly.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.
• RoHS compliant: Meets lead‑free and hazardous‑substance requirements for streamlined product compliance.

Why Choose 5SGXMA5H2F35C2LG?

The 5SGXMA5H2F35C2LG combines large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, making it well suited to complex, logic‑heavy commercial FPGA designs. Its core voltage range and documented Stratix V electrical and switching characteristics provide the data needed for careful power and timing planning.

This device is a practical choice for designers seeking a high‑capacity Stratix V GX FPGA for applications that require dense integration, substantial on‑chip RAM, and broad I/O capabilities within a commercial temperature envelope.

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