5SGXMA5H2F35C1WN

The 5SGXMA5H2F35C1WN is a Stratix V GX family FPGA from Intel, delivered in a high-density 1152-BBGA (1152-FBGA, 35×35) surface-mount package. It provides substantial on-chip resources—approximately 490,000 logic elements and roughly 46.08 Mbits of embedded memory—along with a high I/O count, making it suitable for complex digital designs that require dense logic, large embedded memory, and extensive I/O integration.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement large-scale digital designs and custom processing pipelines.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage without external memory in many designs.
• I/O Resources  552 user I/O pins to support multi-channel interfaces, sensor arrays, and dense board-level connectivity.
• Package & Mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact, high-density PCB implementations.
• Power  Core supply range of 870 mV to 930 mV, enabling precise power budgeting at the FPGA core.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implements large custom compute functions and hardware-accelerated logic that require substantial logic resources and on-chip memory.
• Multi-channel I/O systems  Supports designs with many parallel interfaces or high pin-count peripheral arrays using 552 I/O pins.
• Embedded systems and platform prototyping  Provides a scalable hardware platform for validating complex system architectures with abundant logic and RAM.

Unique Advantages

• Extensive logic capacity:  Approximately 490,000 logic elements enable integration of large state machines, DSP blocks, and custom accelerators on a single device.
• Significant on-chip memory:  About 46.08 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage tasks, simplifying board design.
• High I/O density:  552 I/O pins support dense peripheral interfacing and multi-channel connectivity without multiplexing compromises.
• Compact, high‑density package:  1152-FBGA (35×35) package offers a high pin count in a compact footprint for space-constrained PCBs.
• Commercial temperature rating:  0 °C to 85 °C specification fits standard commercial deployments and product designs.
• Regulatory compliance:  RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose 5SGXMA5H2F35C1WN?

The 5SGXMA5H2F35C1WN combines a large logic fabric, substantial embedded memory, and high I/O density in a compact 1152-FBGA package, making it well suited for engineers building complex, board-level FPGA systems that demand on-chip capacity and dense interfacing. As a commercial‑grade Stratix V GX device from Intel, it delivers a clear specification set for power, temperature, and package that supports robust design planning and integration.

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