5SGXMA5H2F35C1G

The 5SGXMA5H2F35C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offered in a 1152‑ball BGA package for surface‑mount assembly. It provides a high device density with large on‑chip memory and a substantial I/O count for complex digital designs targeted at commercial temperature operation.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 552 general‑purpose I/Os, this device addresses designs that require substantial logic fabric, local RAM, and extensive external interfacing while operating on a core supply between 870 mV and 930 mV.

Key Features

• Core density  490,000 logic elements to implement complex digital functions and large logic designs.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM for local buffering, storage, and state retention.
• I/O capacity  552 I/O pins to support dense external interfacing and multiple parallel peripherals.
• Power supply  Core voltage range of 870 mV to 930 mV, supporting the device's operating requirements.
• Package and mounting  1152‑BBGA (FCBGA) package; supplier package specified as 1152‑FBGA (35×35). Surface mount mounting type.
• Operating range  Commercial temperature grade with operating temperature from 0 °C to 85 °C.
• Environmental compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Implement large custom logic blocks and complex finite state machines using the device's 490,000 logic elements and on‑chip RAM.
• Data buffering and packet handling  Embedded memory capacity supports local buffering and temporary storage in data‑path or packet‑processing functions.
• Multi‑interface systems  High I/O count enables integration with numerous external peripherals, parallel busses, and multiple I/O domains.

Unique Advantages

• Substantial logic capacity: 490,000 logic elements allow consolidation of large functions into a single device, reducing board-level component count.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM helps minimize external memory dependency and improves data locality.
• High I/O density: 552 I/Os support broad external connectivity for sensors, processors, or parallel interfaces without external expanders.
• Industry‑ready package: 1152‑BBGA (1152‑FBGA supplier package) in a 35×35 footprint supports compact, high‑density PCB layouts.
• Commercial temperature rating: Designed for 0 °C to 85 °C environments common to many enterprise and industrial‑adjacent applications.
• Regulatory compliance: RoHS compliance supports environmentally conscious designs and supply chain requirements.

Why Choose 5SGXMA5H2F35C1G?

The 5SGXMA5H2F35C1G combines large logic capacity, substantial embedded memory, and a high I/O count in a compact 1152‑ball BGA package, making it suited for designs that demand dense logic integration and extensive external interfacing within a commercial temperature envelope. The defined core voltage range and RoHS compliance enable straightforward power implementation and regulatory alignment.

This part is appropriate for engineering teams building feature‑rich systems that benefit from on‑device memory and numerous I/Os, offering a platform capable of consolidating functions and simplifying board‑level design choices while leveraging the Stratix V GX family attributes documented for this series.

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