5SGXMA5H1F35I2WN

The 5SGXMA5H1F35I2WN is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35) package for surface‑mount assembly. It delivers a high logic capacity with 490,000 logic elements and approximately 46.08 Mbits of embedded memory, alongside a large 552‑pin I/O complement.

Engineered for industrial temperature environments, this device operates from −40 °C to 100 °C and uses a low‑voltage core supply range of 0.87 V to 0.93 V. RoHS compliant and provided in a compact FCBGA footprint, it is targeted at designs that require dense programmable logic, substantial on‑chip memory, and extensive I/O routing.

Key Features

• Core Logic  490,000 logic elements provide large programmable logic capacity for complex digital designs.
• On‑Chip Memory  Approximately 46.08 Mbits of embedded RAM to support data buffering, lookup tables, and local storage without external memory in many use cases.
• I/O Density  552 available I/O pins to accommodate extensive external interfaces and parallel connectivity.
• Package & Mounting  1152‑FBGA (35×35) FCBGA package, surface mount, suitable for compact board layouts requiring high pin counts.
• Power Envelope  Core voltage supply specified from 870 mV to 930 mV for designs that require tightly controlled low‑voltage operation.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment thermal requirements.
• Environmental Compliance  RoHS compliant to support environmentally regulated product assemblies.

Typical Applications

• Industrial Control Systems  High logic density and industrial temperature rating make this device suitable for control and automation platforms that demand robust operation across wide ambient temperatures.
• Communications Infrastructure  Large I/O capacity and significant on‑chip RAM support complex interface aggregation and buffering tasks in network equipment.
• High‑Density Signal Processing  The combination of abundant logic elements and embedded memory enables implementation of compute‑heavy data paths and local storage for real‑time processing.
• Board‑Level Integration  Compact 1152‑FBGA package with surface‑mount mounting fits high‑pin‑count system designs where board space and routing density are constrained.

Unique Advantages

• Large Programmable Fabric: 490,000 logic elements allow designers to implement complex functions and consolidate multiple subsystems into a single device, reducing BOM and board complexity.
• Substantial Embedded Memory: Approximately 46.08 Mbits of RAM provides on‑chip buffering and storage to accelerate data‑intensive tasks and reduce external memory bandwidth needs.
• Extensive I/O Resources: 552 I/Os enable rich peripheral and interface support without immediate dependence on external multiplexers or expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C and designated industrial grade for applications requiring extended temperature performance.
• Low‑Voltage Core: Core supply specified at 0.87–0.93 V supports low‑power core operation strategies in system power budgets.
• RoHS Compliant Packaging: Helps simplify regulatory compliance for environmentally conscious product builds.

Why Choose 5SGXMA5H1F35I2WN?

This Stratix V GX FPGA combines a high logic element count, large embedded memory, and an extensive I/O complement in a compact 1152‑FBGA package, making it well suited to industrial designs that require dense programmable logic and robust thermal performance. Its low core voltage and RoHS compliance further align it with modern power and environmental requirements.

Designers and procurement teams seeking a scalable, high‑capacity FPGA for industrial and infrastructure applications will find the 5SGXMA5H1F35I2WN offers a balanced mix of integration, I/O density, and on‑chip memory to simplify system architecture and reduce external component count.

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