5SGXMA5H1F35C2N

The 5SGXMA5H1F35C2N is a Stratix V GX family FPGA in a 1152-BBGA (FCBGA) package from Intel. It delivers high logic density and substantial embedded memory in a surface-mount, commercial-grade device suited for complex programmable hardware designs.

With 490,000 logic elements, approximately 46 Mbits of on-chip RAM, and 552 user I/Os, this FPGA targets applications that require large-scale programmable logic, significant on-chip storage, and broad I/O connectivity while operating at a core supply between 870 mV and 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  490,000 logic elements for implementing large, complex logic designs and multi-function hardware blocks.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Capacity  552 user I/Os to support wide data buses, multiple interfaces, and extensive external connectivity.
• Package and Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for compact system integration.
• Power  Core voltage supply range from 870 mV to 930 mV to match modern low-voltage FPGA power domains.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• High‑density logic implementations  Use the 490,000 logic elements for large finite-state machines, protocol stacks, and custom accelerators where extensive programmable logic is required.
• On‑chip buffering and data paths  Approximately 46 Mbits of embedded RAM supports deep buffering, FIFOs, and streaming data processing directly on-chip.
• Complex multi‑I/O systems  552 I/Os enable broad external interfacing for multi-channel data acquisition, wide parallel buses, or mixed-signal front-end connectivity.
• Compact FPGA modules  The 1152-BBGA (35×35) package and surface-mount mount type suit dense board-level implementations where space is limited.

Unique Advantages

• High logic density: The large count of logic elements enables consolidation of multiple functions into a single device, reducing system BOM and board area.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM minimizes external memory dependencies for many data-path and buffering needs.
• Extensive I/O connectivity: 552 I/Os provide flexibility to support numerous peripherals, parallel interfaces, and custom pinouts without external multiplexing.
• Compact, manufacturable package: 1152-BBGA (FCBGA) in a 35×35 supplier package supports high-density PCB layouts and automated surface-mount assembly.
• Designed for commercial deployments: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
• Low-voltage core operation: Core supply range of 870–930 mV is compatible with modern low-voltage system power rails.

Why Choose 5SGXMA5H1F35C2N?

The 5SGXMA5H1F35C2N positions itself as a high-density, commercially rated Stratix V GX FPGA option for designers who need extensive programmable logic, large embedded memory, and broad I/O capability in a compact surface-mount package. Its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM, and 552 I/Os simplifies system architectures by enabling consolidation of functions and reducing external components.

This device is suited for engineering teams building complex data-paths, multi-interface controllers, and high‑functionality programmable hardware where commercial temperature range, RoHS compliance, and a compact FCBGA footprint are required.

Request a quote or submit an inquiry for pricing, availability, and lead-time details to move your design forward with the 5SGXMA5H1F35C2N FPGA.