5SGXMA5H1F35C1WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 281 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5H1F35C1WN – Stratix® V GX FPGA, 490K Logic Elements, 552 I/Os
The 5SGXMA5H1F35C1WN is an Intel Stratix® V GX field-programmable gate array (FPGA) delivered in a high-density 1152-ball FCBGA package. It combines large logic capacity with substantial embedded memory and a high I/O count to address demanding commercial designs that require extensive programmable logic and system integration.
Designed for applications that need high logic density, abundant on-chip RAM, and a large number of I/Os, this commercial-grade Stratix V GX device provides a configurable platform for advanced digital signal processing, high-bandwidth I/O systems, and complex control logic.
Key Features
- Logic Capacity — 490,000 logic elements providing extensive programmable fabric; equivalent to approximately 185,000 logic cells for large-scale logic mapping and partitioning.
- Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage for DSP and packet processing tasks.
- I/O Count — 552 device I/Os to support wide parallel interfaces, multiple high-pin-count peripherals, and board-level routing flexibility.
- Package & Mounting — 1152-BBGA, FCBGA package; supplier package listed as 1152-FBGA (35×35). Surface-mount mounting type for modern PCB assembly.
- Power Requirements — Core voltage supply range of 870 mV to 930 mV for the device core.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
- Standards Compliance — RoHS compliant to meet common environmental and manufacturing requirements.
- Stratix V GX Family — Device is part of the Stratix V GX family; the family datasheet documents transceiver, I/O timing, and electrical characteristics for Stratix V devices.
Typical Applications
- High‑performance communications — Large logic fabric and abundant I/O make this device suitable for networking equipment and high-bandwidth link implementations that require on-chip processing and wide interface support.
- Digital signal processing — Substantial logic capacity and approximately 46 Mbits of embedded memory support DSP pipelines, filtering, and buffering for real-time signal processing tasks.
- Server and storage accelerators — High logic density and many I/Os enable custom offload engines, packet inspection, and data-path acceleration in commercial compute and storage systems.
- Complex control and protocol bridging — Use the device to implement multi-protocol bridging, custom control logic, and glue logic for systems requiring many discrete interfaces.
Unique Advantages
- High logic density: 490,000 logic elements let you consolidate wide functionality into a single device and reduce board-level component count.
- Large on‑chip RAM: Approximately 46 Mbits of embedded memory minimizes external memory dependence for buffering and state storage.
- Extensive I/O availability: 552 I/Os provide flexibility for parallel interfaces, wide datapaths, and numerous peripherals without adding external I/O expansion.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation to match commercial deployment environments and reduce qualification effort for non-industrial applications.
- RoHS compliant: Meets common environmental manufacturing requirements to simplify procurement and manufacturing compliance.
- Compact FCBGA package: 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount packaging supports high pin density in a single, assembly-friendly footprint.
Why Choose 5SGXMA5H1F35C1WN?
This Stratix V GX FPGA delivers large programmable capacity, substantial embedded RAM, and a high I/O count in a single commercial‑grade device, enabling consolidation of complex functions onto one chip. It is suited for engineers and teams building high-throughput communications, DSP-heavy systems, and custom accelerators that require scalable logic, on-chip memory, and dense interface options.
With a controlled core voltage range and documented Stratix V electrical and I/O characteristics, the 5SGXMA5H1F35C1WN supports reliable integration into commercial designs where on‑chip resources and I/O density are primary design drivers.
Request a quote or submit an inquiry to obtain pricing and availability for 5SGXMA5H1F35C1WN and evaluate how this Stratix® V GX FPGA can fit into your next high-density, high-performance design.

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