5SGXMA5H2F35I2G

The 5SGXMA5H2F35I2G is a Stratix V GX family field-programmable gate array (FPGA) from Intel, architected for high‑density programmable logic and extensive I/O integration. This device combines a large logic fabric with substantial embedded RAM and a broad I/O count to address demanding designs that require on‑chip memory, high logic capacity, and board‑level integration.

Documented in the Stratix V device datasheet, the device’s specifications cover electrical and switching characteristics including transceiver behavior and I/O timing, enabling designers to evaluate performance and integration needs against measured device parameters.

Key Features

• Logic Capacity  490,000 logic elements (cells) to implement large-scale programmable logic and complex finite state machines.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM for buffers, FIFOs, and tightly coupled data storage.
• Extensive I/O  552 general-purpose I/O pins to support wide parallel interfaces and multi‑lane connectivity requirements.
• Power and Core Supply  Core voltage supply range specified at 870 mV to 930 mV for use within defined operating conditions.
• Thermal and Environmental  Industrial temperature grade with an operating range of −40 °C to 100 °C and RoHS compliance for environmental compatibility.
• Package and Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount device for PCB assembly.
• Stratix V GX Family Attributes  As a Stratix V GX device, the family’s datasheet documents transceiver and core speed grade options and the electrical/switching characteristic set used for system design.

Typical Applications

• High‑density programmable logic  Implement complex digital logic, algorithmic accelerators, and large glue‑logic functions directly on a single FPGA.
• I/O‑intensive systems  Support wide bus interfaces, multiple peripherals, and parallel data paths using the device’s 552 I/Os.
• Embedded memory‑centric designs  Use the approximately 46.08 Mbits of on‑chip RAM for buffering, lookup tables, and latency‑sensitive data storage.
• Industrial environments  Deploy in systems requiring an extended operating temperature range from −40 °C to 100 °C.

Unique Advantages

• High logic density: 490,000 logic elements enable consolidation of large designs and reduce the need for multiple FPGAs.
• Substantial embedded memory: Approximately 46.08 Mbits of RAM minimizes external memory dependence for many buffering and processing tasks.
• Large I/O footprint: 552 I/Os offer flexible interfacing to a variety of parallel and serial front‑ends without extensive external glue logic.
• Industrial temperature support: Rated from −40 °C to 100 °C for designs that require extended ambient operation.
• Surface mount, high‑density package: 1152‑BBGA (FCBGA) / 1152‑FBGA (35×35) packages enable dense board layouts and reliable solder reflow assembly.
• Datasheet‑documented electrical and switching parameters: Comprehensive Stratix V device datasheet coverage supports informed selection and system integration.

Why Choose 5SGXMA5H2F35I2G?

The 5SGXMA5H2F35I2G provides a balanced combination of high logic capacity, significant on‑chip RAM, and a large I/O count in a single Stratix V GX FPGA package. Its specified core voltage range and documented electrical/switching characteristics support precise power and timing design, while the industrial operating range and RoHS compliance make it suitable for deployed systems requiring environmental resilience.

This device is appropriate for engineering teams building complex programmable systems that prioritize consolidation of logic and memory on‑chip, require broad connectivity, and depend on datasheet‑level specifications for reliable integration and verification.

Request a quote or submit an inquiry to evaluate 5SGXMA5H2F35I2G for your next high‑density FPGA design.