5SGXMA5H2F35I2LN

The 5SGXMA5H2F35I2LN is a Stratix V GX field-programmable gate array (FPGA) in an industrial-grade FBGA package. Built for high-density programmable logic, it integrates a large number of logic cells and substantial embedded RAM to support complex, large-scale designs that require many I/O and on-chip memory resources.

Key attributes include approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, 552 user I/Os, and an industrial operating temperature range, making it suitable for demanding embedded and system-level applications that require sustained operation across a wide temperature window.

Key Features

• High Logic Density  Approximately 490,000 logic elements (cells) and 185,000 LABs enable implementation of large, complex logic functions and deep processing pipelines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for large buffers, tables, and data storage without relying solely on external memory.
• High I/O Count  552 user I/Os provide extensive connectivity for parallel interfaces, multi-channel systems, and multi-board I/O requirements.
• Powering and Core Voltage  Core voltage supply range from 820 mV to 880 mV to match system power-rail requirements and enable defined power delivery design.
• Robust Thermal Range  Industrial-grade operating temperature from –40°C to 100°C for reliable function in extended-temperature environments.
• Package and Mounting  1152-ball BGA (FCBGA) / 1152-FBGA (35 × 35 mm) package in a surface-mount form factor for high-density PCB integration.
• Compliance  RoHS-compliant construction for conformity with lead-free manufacturing requirements.

Unique Advantages

• Large on-chip logic capacity: The high logic-element count lets you integrate complex state machines, DSP blocks, and custom accelerators on a single device, reducing system partitioning.
• Significant embedded memory: Nearly 46 Mbits of RAM supports large FIFOs, frame buffers, and lookup tables without immediate reliance on external DRAM.
• Extensive I/O availability: 552 I/Os simplify board-level routing for multi-channel interfaces and reduce the need for external I/O expanders.
• Industrial temperature range: Rated from –40°C to 100°C for deployments that must tolerate extended temperature conditions.
• Compact, high-density package: 1152-BBGA FCBGA (35 × 35 mm) delivers high connectivity in a surface-mount footprint suitable for compact system designs.
• Regulatory readiness: RoHS compliance supports lead‑free manufacturing flows and environmental requirements.

Why Choose 5SGXMA5H2F35I2LN?

The 5SGXMA5H2F35I2LN positions itself as a high-density Stratix V GX FPGA option when large logic capacity, abundant on-chip RAM, and significant I/O count are primary design drivers. Its industrial temperature rating and defined core voltage window support designs that demand robust operation and controlled power delivery.

Engineers targeting complex programmable logic solutions—where integration, memory bandwidth, and I/O density reduce system complexity—will find this device provides a clear hardware foundation. The combination of high logic element count, substantial embedded memory, and a high-pin-count FBGA package helps consolidate functionality and streamline board-level architecture.

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