5SGXMA5H2F35I3G

The 5SGXMA5H2F35I3G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152‑BBGA (FCBGA) package. It offers high device density with 490,000 logic elements, approximately 46 Mbits of embedded RAM, and 552 I/O pins.

As an industrial‑grade Stratix V family device, this FPGA is suited to designs that require substantial on‑chip logic, memory resources, and high I/O count, while operating across an industrial temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements (logic cells) for implementing large-scale digital logic and complex designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, state storage, and data processing without immediate reliance on external memory.
• I/O Density  552 general‑purpose I/O pins to support high‑pin‑count interfaces and system integration.
• Package  1152‑BBGA, FCBGA package; supplier device package listed as 1152‑FBGA (35×35) for high‑density board mounting.
• Voltage Supply  Core supply voltage range: 820 mV to 880 mV.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Standards & Compliance  RoHS compliant for use in assemblies that require lead‑free components.
• Stratix V Family  Part of the Stratix V series; series documentation provides detailed electrical and transceiver characteristics for system design and qualification.

Typical Applications

• High‑density programmable logic systems  Implement large digital designs leveraging the device’s high logic element count and embedded RAM.
• I/O‑intensive systems  Board designs requiring numerous external interfaces benefit from 552 available I/Os.
• Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) enables deployment in harsh or temperature‑variable environments.
• Platform development and prototyping  Large logic and memory resources support complex prototypes and platform validation within the Stratix V family.

Unique Advantages

• High logic capacity: 490,000 logic elements accommodate sophisticated algorithms and wide data‑path implementations.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
• Extensive I/O: 552 I/Os streamline system integration and reduce the need for additional interface components.
• Industrial reliability: Rated for −40 °C to 100 °C operation for use in demanding environments.
• Compact, high‑density package: 1152‑BBGA (1152‑FBGA supplier package, 35×35) provides a dense mounting footprint for space‑constrained systems.
• Regulatory compliance: RoHS compliant for lead‑free production environments.

Why Choose 5SGXMA5H2F35I3G?

The 5SGXMA5H2F35I3G positions itself as a high‑density, industrial‑grade Stratix V GX FPGA that brings together substantial logic resources, large on‑chip memory, and a high I/O count in a compact FCBGA package. Its specified core voltage range and industrial temperature rating make it a clear option for designs that require both integration density and environmental robustness.

Engineers and procurement teams looking for a scalable Stratix V family device will find this part appropriate for complex digital systems, I/O‑rich applications, and industrial deployments where long‑term availability and documented device electrical characteristics are required.

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