5SGXMA5H2F35I3LN

The 5SGXMA5H2F35I3LN is a Stratix® V GX field-programmable gate array (FPGA) device supplied in a high-density FCBGA package. It targets designs that require a large logic fabric, substantial embedded memory, and extensive I/O capability while operating across an industrial temperature range.

With 490,000 logic elements and approximately 46 Mbits of embedded RAM, this device is suited for high-density digital designs where on-chip resources and I/O count are primary drivers for system integration and performance.

Key Features

• Core Logic — 490,000 logic elements for complex programmable logic implementations and high-density design consolidation.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory dependency.
• I/O Density — 552 user I/O pins to interface with multiple peripherals, sensors, and high-pin-count subsystems.
• Power Supply — Core voltage range from 820 mV to 880 mV for integration with modern low-voltage power architectures.
• Package and Mounting — 1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board-level integration.
• Temperature Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in rugged environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded RAM to implement complex processing pipelines and custom accelerators on-chip.
• Communication and I/O aggregation — Leverage 552 I/O pins for multi-channel interfaces, protocol bridging, and high-pin-count front-end systems.
• Embedded system integration — Consolidate functions that otherwise require multiple ICs by using on-chip logic and memory to reduce BOM and board area.

Unique Advantages

• Substantial on-chip resources — With 490,000 logic elements and roughly 46 Mbits of RAM, designers can implement large-scale logic and memory-hungry functions without relying solely on external components.
• High I/O count — 552 I/O pins enable flexible interfacing to a wide range of peripherals and parallel data paths, simplifying board routing for I/O-heavy applications.
• Industrial temperature support — Rated for −40 °C to 100 °C operation, enabling deployment in environments with extended temperature requirements.
• Compact, manufacturable package — 1152-ball FCBGA surface-mount package (35×35) supports high-density PCB designs and automated assembly processes.
• Low-voltage core operation — 820 mV to 880 mV core supply range aligns with modern low-voltage system designs to optimize power delivery and efficiency.
• Regulatory compliance — RoHS compliance supports environmental and regulatory requirements for many commercial and industrial products.

Why Choose 5SGXMA5H2F35I3LN?

The 5SGXMA5H2F35I3LN combines a large programmable fabric, substantial embedded memory, and extensive I/O in an industrial-grade FPGA package. It is positioned for designs that require on-chip capacity to reduce external components, support complex logic, and maintain reliable operation across a wide temperature range.

This device is well suited for development teams and OEMs building high-density digital systems, communication interfaces, or embedded platforms where integration density, I/O flexibility, and industrial temperature performance are key selection criteria.

Request a quote or submit an inquiry to discuss availability, lead times, and volume pricing for the 5SGXMA5H2F35I3LN. Our team can help provide the information you need to move your design forward.