5SGXMA5H3F35C2G

The 5SGXMA5H3F35C2G is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density, reconfigurable logic implementations. As a member of the Stratix V GX family, the device targets designs that require large programmable logic capacity, substantial embedded memory, and extensive I/O.

With 490,000 logic elements, approximately 46 Mbits of embedded RAM, and 552 I/O pins in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package, this commercial‑grade FPGA is suited for systems where integration density and flexible I/O are critical. The device operates at a core supply range of 870 mV to 930 mV and is specified for 0 °C to 85 °C.

Key Features

• High Logic Capacity  490,000 logic elements provide broad programmable logic resources for complex designs and large-scale integration.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, packet processing, and state storage without external memory for many functions.
• Extensive I/O  552 general-purpose I/O pins support diverse interfacing and high pin-count system requirements.
• Stratix V GX Family  Part of the Stratix V GX device family; the device and family datasheet describe the available transceiver speed grades for high‑speed serial channels.
• Power and Core Voltage  Core supply voltage range from 870 mV to 930 mV to align with low-voltage FPGA core domains.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial applications.
• Package and Mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board designs.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High‑density FPGA systems  Implement large logic designs and complex state machines using the device’s 490,000 logic elements and substantial on‑chip RAM.
• High‑pin-count interfacing  Leverage 552 I/O pins for multi‑lane interfaces, parallel buses, and extensive sensor or peripheral connectivity.
• Board-level integration and prototyping  The 1152-FBGA (35×35) surface-mount package enables compact, production-amenable PCB layouts for system prototypes and end devices.

Unique Advantages

• Large programmable fabric: 490,000 logic elements simplify consolidation of multiple functions into a single device, reducing BOM complexity.
• Significant embedded memory: Approximately 46 Mbits of on‑chip RAM minimize reliance on external memory for many buffering and processing tasks.
• High I/O density: 552 I/O pins provide flexibility for complex I/O schemes and integration of numerous peripherals or interface standards.
• Compact surface-mount package: 1152‑BBGA (1152‑FBGA, 35×35) supports compact board layouts and scalable production assembly.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial deployments.
• Environmental compliance: RoHS compliance supports environmentally conscious production requirements.

Why Choose 5SGXMA5H3F35C2G?

The 5SGXMA5H3F35C2G delivers a combination of large logic capacity, substantial embedded RAM, and high I/O count in a production-friendly 1152-BBGA surface-mount package. It is positioned for commercial designs that require dense, reconfigurable logic with flexible interfacing and reliable electrical characteristics.

Designers and procurement teams building mid- to high-complexity FPGA-based systems will find this Stratix V GX device suitable where on‑chip resources, compact board integration, and RoHS compliance are key selection criteria.

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