5SGXMA5H3F35C2LN

The 5SGXMA5H3F35C2LN is a Stratix® V GX field‑programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package designed for high‑density, reconfigurable logic integration. This commercial‑grade device delivers large logic capacity, substantial on‑chip RAM, and extensive I/O to support complex system designs that require flexible hardware acceleration and high pin count connectivity.

Engineered for applications that need scalable programmable logic and embedded memory, the device combines 490,000 logic elements with approximately 46.08 Mbits of embedded RAM and 552 I/O pins in a compact surface‑mount package.

Key Features

• Logic Capacity — 490,000 logic elements provide extensive programmable logic for implementing large state machines, datapaths, and custom hardware accelerators.
• Embedded Memory — Approximately 46.08 Mbits of on‑chip RAM for buffers, FIFOs, and storage tightly coupled to logic for low‑latency data handling.
• I/O Density — 552 user I/O pins enable high‑pin‑count interfaces and flexible board routing for complex multi‑channel systems.
• Power and Core Supply — Core voltage supply range of 820 mV to 880 mV specified for the device.
• Package and Mounting — 1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact, high‑density board designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suited to standard commercial environments.
• Standards Compliance — RoHS‑compliant manufacturing.

Typical Applications

• Reconfigurable Hardware Acceleration — Use the large logic element count and embedded RAM to implement custom accelerators for signal processing and compute‑intensive tasks.
• High‑Pin‑Count Interface Systems — 552 I/O pins support multi‑channel data interfaces, complex peripheral connectivity, and high‑density board interconnects.
• Prototyping and System Integration — Surface‑mount 1152‑BBGA packaging enables integration into compact boards for prototyping and final system deployments in commercial applications.

Unique Advantages

• High Logic Density: 490,000 logic elements enable large, integrated designs that reduce the need for multiple discrete devices.
• Substantial On‑Chip Memory: Approximately 46.08 Mbits of embedded RAM provides local storage for buffering and dataflow acceleration without external memory dependency.
• Extensive I/O Count: 552 I/Os accommodate complex peripheral sets and multiple high‑speed interfaces on a single FPGA.
• Compact, Surface‑Mount Package: 1152‑BBGA (35×35) package delivers high pin density in a compact footprint for space‑constrained designs.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for standard commercial environments and deployments.
• RoHS‑Compliant: Manufactured to meet RoHS requirements for environmentally conscious designs.

Why Choose 5SGXMA5H3F35C2LN?

The 5SGXMA5H3F35C2LN combines large logic resources, significant embedded memory, and a high I/O count in a single commercial‑grade Stratix V GX FPGA package. Its specifications make it suitable for designers seeking to consolidate functionality, implement complex data paths, and integrate multiple interfaces without adding external programmable devices.

For teams working on advanced, high‑density designs that require scalable programmable logic and on‑chip buffering, this device offers a balance of capacity, connectivity, and a compact package backed by Stratix V family documentation and electrical characterization.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the 5SGXMA5H3F35C2LN. Our team can provide proposal details and help match device supply to your design timeline.