5SGXMA5H3F35C3N

The 5SGXMA5H3F35C3N is a Stratix® V GX family FPGA from Intel, delivered in a 1152-FBGA (35×35) surface-mount package. It provides a high-capacity, commercial-grade programmable logic platform with a large logic element count, substantial on-chip RAM, and an extensive I/O complement for complex digital system designs.

Designed for applications that require high logic density and broad connectivity, this device combines approximately 490,000 logic elements, about 46 Mbits of embedded memory, and 552 I/O pins to support advanced integration and system connectivity within the commercial temperature range.

Key Features

• Core Logic — Approximately 490,000 logic elements to implement large-scale programmable logic and complex custom architectures.
• Logic Structure — 185,000 LABs/CLBs reported in the device specification to support hierarchical and parallel logic partitioning.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and data processing without external memory dependency.
• I/O Capacity — 552 programmable I/O pins to enable high-channel-count interfaces and broad system connectivity.
• Package & Mounting — 1152-FBGA (35×35) FCBGA / 1152-BBGA surface-mount package for compact board-level integration.
• Power — Core voltage supply range specified at 820 mV to 880 mV to match platform power designs.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard environmental conditions.
• Compliance — RoHS compliant per supplier information.

Typical Applications

• High-density logic designs — Implement large, custom digital functions that require approximately 490,000 logic elements for complex algorithms and data paths.
• Memory-intensive processing — Use the device’s approximately 46 Mbits of embedded RAM for on-chip buffering, lookup tables, and intermediate data storage.
• High-pin-count systems — Leverage 552 I/O pins to connect multiple peripherals, sensors, or parallel interfaces without extensive external glue logic.

Unique Advantages

• High logic capacity: Approximately 490,000 logic elements enable large-scale integration of custom logic and state machines on a single device.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many intermediate buffering and storage needs.
• Extensive I/O resources: 552 I/Os provide flexibility for multi-channel I/O, expanded peripheral support, and dense board-level interfaces.
• Compact, surface-mount packaging: 1152-FBGA (35×35) FCBGA / 1152-BBGA package enables high-density PCB designs and reliable board assembly.
• Commercial-ready thermal range: Rated for 0 °C to 85 °C to suit typical commercial deployments and environments.
• Defined core supply window: 820 mV–880 mV supply requirement allows precise power budgeting for platform designers.

Why Choose 5SGXMA5H3F35C3N?

The 5SGXMA5H3F35C3N positions itself as a high-capacity Stratix V GX FPGA option for commercial designs that demand extensive logic, significant embedded memory, and broad I/O connectivity. Its combination of approximately 490,000 logic elements, around 46 Mbits of on-chip RAM, and 552 I/Os makes it suitable for complex system integration where density and connectivity are priorities.

Backed by Intel’s Stratix V device documentation and specifications, this device offers a clear, verifiable set of electrical and package characteristics (including an 820 mV–880 mV core supply and 0 °C–85 °C operating range) to aid system architects and procurement teams in making informed design and sourcing decisions.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering details for the 5SGXMA5H3F35C3N.