5SGXMA5H3F35C3G

The 5SGXMA5H3F35C3G is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball BGA package designed for commercial-grade, high-density digital designs. It integrates a large logic fabric, substantial on-chip memory, and extensive I/O to support complex, high‑performance system implementations.

As a member of the Stratix V GX family, the device targets applications that require a high count of logic elements, abundant embedded memory, and numerous I/O channels while operating within standard commercial temperature and supply ranges.

Key Features

• High Logic Density — 490,000 logic elements to implement large, complex logic designs and deep custom datapaths.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and embedded storage for data processing.
• I/O Capacity — 552 user I/O pins provide broad connectivity for high‑pin-count board designs and multi‑lane interfaces.
• Package & Mounting — 1152‑BBGA (supplier package listed as 1152‑FBGA, 35×35) in a surface-mount form factor for compact, board‑level integration.
• Power Supply — Core supply range from 820 mV to 880 mV, enabling predictable core power design and sequencing.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial‑temperature applications.
• RoHS Compliant — Meets environmental compliance requirements for lead‑free manufacturing.
• Stratix V GX Family Capability — As part of the Stratix V GX family, the platform supports the family’s documented transceiver and I/O capabilities (refer to Stratix V device documentation for family-level transceiver grades and options).

Typical Applications

• High‑density digital processing — Deploy the device where a large logic count and significant on‑chip RAM are required to implement complex algorithms and datapaths.
• High‑pin-count board systems — Use the 552 I/O pins for multi‑interface boards requiring many parallel or serial I/O channels.
• System prototyping and integration — Leverage the Stratix V GX family characteristics for prototyping high‑performance designs that require scalable FPGA resources.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable integration of multiple system functions into a single device, reducing external component count.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM lowers dependence on external memory for buffering and temporary storage.
• Extensive connectivity: 552 I/Os provide flexibility to interface with high‑channel-count peripherals and board-level signals without extensive routing compromise.
• Compact, manufacturable package: 1152‑BBGA (35×35) in a surface‑mount package supports dense board layouts and automated assembly processes.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployment and manufacturing requirements.

Why Choose 5SGXMA5H3F35C3G?

The 5SGXMA5H3F35C3G delivers a balance of high logic capacity, sizable embedded memory, and broad I/O in a compact BGA footprint, making it suitable for commercial designs that demand integration and flexibility. Its Stratix V GX family lineage provides access to family-level capabilities documented in the device series, while the commercial temperature grade and RoHS compliance support standard production environments.

This device is well suited for engineering teams building high-density digital systems that require significant on‑chip resources, predictable core supply characteristics, and a manufacturing-friendly package.

If you’d like pricing, availability, or technical assistance with evaluating 5SGXMA5H3F35C3G for your design, request a quote or submit an inquiry to receive a tailored response and support.