5SGXMA5H3F35C4G

The 5SGXMA5H3F35C4G is a Stratix® V GX family FPGA from Intel, delivered in a 1152‑FBGA (35×35) surface-mount package. It provides high logic density and abundant embedded memory for complex digital designs that require a large number of I/O and on-chip resources.

This commercial‑grade device offers approximately 490,000 logic elements and roughly 46 Mbits of embedded memory, with a supply voltage window optimized for low-voltage core operation and support for up to 552 user I/O pins.

Key Features

• Core Logic  Approximately 490,000 logic elements, enabling implementation of large-scale digital logic and complex algorithms on a single device.
• Logic Array Blocks  185,000 reported logic array blocks (LABs/CLBs) for structured logic placement and routing.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM (46,080,000 bits) for buffering, FIFOs, and distributed data storage without external memory.
• I/O Capacity  Up to 552 user I/O pins to interface with high-pin-count systems and multiple peripheral buses.
• Power and Voltage  Core supply voltage range of 820 mV to 880 mV, suitable for low-voltage FPGA core operation.
• Package and Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA 35×35) designed for surface-mount assembly and high-density board layouts.
• Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory Status  RoHS compliant.

Unique Advantages

• High logic density: The large pool of logic elements supports complex, integrated digital systems that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory, lowering BOM and simplifying board design.
• Extensive I/O availability: 552 I/O pins provide flexibility for multi-channel interfaces, wide buses, and dense peripheral connectivity.
• Compact, high‑pin package: The 1152‑FBGA (35×35) package enables high I/O and logic capacity in a board‑space efficient form factor.
• Low-voltage core operation: Core supply window of 820–880 mV supports modern low-voltage power architectures for reduced power dissipation.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial product deployments and development platforms.

Why Choose 5SGXMA5H3F35C4G?

The 5SGXMA5H3F35C4G positions itself as a high-capacity Stratix V GX FPGA for designs that require substantial logic, memory, and I/O resources in a single, surface-mount package. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 552 I/O pins makes it appropriate for complex digital processing tasks and dense system integrations.

As a commercial‑grade Intel Stratix V GX device in a compact 1152‑FBGA package and RoHS‑compliant construction, it delivers a balance of integration and board-level footprint that supports scalable designs and streamlined hardware implementations.

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