5SGXMA5H3F35I3G

The 5SGXMA5H3F35I3G is a Stratix V GX field-programmable gate array (FPGA) from Intel, delivered in a 1152-FBGA (35×35) surface-mount package. It provides a high logic capacity FPGA fabric paired with extensive I/O and substantial on-chip memory for demanding industrial applications.

Designed for use in industrial temperature environments, this device integrates approximately 46.08 Mbits of embedded memory, 552 user I/Os, and a low-voltage core supply range, enabling dense, high-bandwidth designs where logic density, I/O count, and thermal robustness are required.

Key Features

• Core Logic Capacity  490,000 logic elements (LEs) for implementing complex digital functions and large-scale logic integration.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffering, tables, and state storage without external memory.
• I/O Resources  552 user I/Os to support high pin-count connectivity and multiple parallel interfaces.
• Package & Mounting  1152-FBGA (35×35) package in a surface-mount form factor for board-level integration.
• Voltage Supply  Core supply specified between 820 mV and 880 mV for defined power and timing operation.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet industrial thermal requirements.
• Stratix V GX Series Transceiver Options  As a Stratix V GX family device, the series provides transceiver speed-grade options documented in the Stratix V device datasheet.
• RoHS Compliant  Manufactured in compliance with RoHS environmental requirements.

Unique Advantages

• High logic density: 490,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces reliance on external memory for buffering and data processing.
• Extensive I/O: 552 I/Os support complex connectivity and parallel interface requirements typical of high-performance systems.
• Industrial thermal range: –40 °C to 100 °C operation supports deployment in thermally challenging environments.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package balances pin count and PCB real-estate for dense designs.
• Defined low-voltage core operation: 820–880 mV supply window enables predictable power and timing characteristics for system-level design.

Why Choose 5SGXMA5H3F35I3G?

The 5SGXMA5H3F35I3G positions itself for designs that require high logic capacity, substantial embedded memory, and large I/O capability in an industrial-temperature FPGA. Its Stratix V GX heritage and documented device specifications give designers a clear electrical and thermal envelope to design against.

This device is well suited to teams needing a scalable, high-density FPGA solution backed by Intel’s Stratix V documentation and device characterization. The combination of logic resources, memory, I/O, and a defined core voltage makes it a practical choice for complex digital systems where integration and predictable operating conditions matter.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for 5SGXMA5H3F35I3G. Technical documentation is available in the Stratix V device datasheet for detailed electrical and switching characteristics.