5SGXMA5H3F35I3LG

The 5SGXMA5H3F35I3LG is an Intel Stratix V GX Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package. It delivers high logic density and on-chip memory capacity for designs that require substantial programmable logic, abundant I/O, and industrial temperature operation.

Key hardware metrics include 490,000 logic elements, approximately 46 Mbits of embedded memory, and 552 user I/Os, making this device suitable for complex, I/O-rich FPGA implementations in industrial environments.

Key Features

• Core Logic  490,000 logic elements for implementing large-scale programmable logic and complex finite-state machines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, LUTRAM, and local data storage.
• I/O Density  552 user I/O pins, enabling broad external interface and connector options for high-channel-count applications.
• Power  Core supply voltage specified between 820 mV and 880 mV for device operation.
• Package & Mounting  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount package optimized for board-level assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in challenging environments.
• Compliance  RoHS-compliant manufacturing status.
• Family-Level Transceiver and Device Support  Part of the Stratix V GX family; electrical and switching characteristics, I/O timing, and available transceiver speed grades are documented in the Stratix V device datasheet.

Unique Advantages

• High Logic Capacity: 490,000 logic elements provide the headroom to implement complex algorithms, large state machines, and extensive parallel processing structures without external logic.
• Substantial On-Chip RAM: Approximately 46 Mbits of embedded memory reduces dependency on external memory for many buffering and streaming use cases, simplifying board design.
• High I/O Count: With 552 I/Os, the device supports multi-channel interfaces and dense connector schemes common in industrial and communications equipment.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C to support deployment in temperature-challenging installations.
• Compact BGA Packaging: The 1152-ball FCBGA package (35×35) enables a compact footprint while accommodating high pin count and advanced routing on PCBs.
• Standards-Aligned Manufacturing: RoHS-compliant construction supports regulatory and environmental requirements.

Why Choose 5SGXMA5H3F35I3LG?

This Stratix V GX FPGA balances high logic element count, large on-chip memory, and extensive I/O in a single industrial-grade package, offering a robust platform for designers needing significant programmable resources and reliable operation across wide temperatures. Its combination of core capacity, memory, and I/O density makes it appropriate for demanding, I/O-intensive, and compute-heavy FPGA implementations.

Engineers and procurement teams can rely on the documented electrical and switching characteristics of the Stratix V family for system-level planning and power budgeting, while RoHS compliance and surface-mount packaging support modern manufacturing flows.

Request a quote or submit an inquiry to our sales team to discuss pricing, lead times, and availability for the 5SGXMA5H3F35I3LG Stratix V GX FPGA.