5SGXMA5H3F35C4WN

The 5SGXMA5H3F35C4WN is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. It integrates dense programmable logic, substantial on‑chip memory, and a high I/O count to support complex digital designs in commercial‑grade environments.

Designed for applications that require large logic capacity, significant embedded memory, and extensive I/O connectivity, this device addresses system designs where integration and board‑level density are priorities.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive kernels.
• I/O Resources  552 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package  1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, 35×35 mm) for high pin‑count, surface‑mount board designs.
• Power  Core voltage supply range 820 mV to 880 mV to define power domain requirements for system design.
• Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C.
• Mounting  Surface mount package suitable for standard PCB assembly processes.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High‑density digital processing  Implement large state machines, accelerators, and datapaths using the device’s ~490k logic elements and embedded memory.
• Data buffering and packet processing  Use the approximately 46 Mbits of on‑chip RAM for packet staging, queues, and temporary storage in communication or compute subsystems.
• Complex I/O interfacing  Leverage 552 I/Os to connect to multiple parallel buses, ADC/DAC front ends, or multi‑lane interfaces on a single FPGA.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable integration of complex functions and consolidation of multiple subsystems into one device.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching tasks.
• Extensive I/O availability: 552 user I/Os allow flexible system partitioning and support for numerous peripherals without additional bridging devices.
• High pin‑count FCBGA package: 1152‑BBGA (35×35 mm) supports dense routing and high I/O density in board designs.
• Commercial temperature rating: Specified for 0 °C to 85 °C, matching a wide range of commercial applications and deployments.
• Precise core supply window: 820 mV to 880 mV specification helps define power delivery and thermal design early in development.

Why Choose 5SGXMA5H3F35C4WN?

The 5SGXMA5H3F35C4WN combines substantial logic resources, a large pool of embedded RAM, and a high I/O count in a compact 1152‑BBGA FCBGA package. This balance of capacity, memory, and connectivity makes it suitable for commercial designs that require integration of complex digital functions and dense I/O interfaces on a single FPGA.

For engineering teams targeting high‑integration board‑level solutions, the device’s defined electrical and thermal parameters (including core voltage range and commercial temperature rating) support clear system‑level planning and implementation.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the 5SGXMA5H3F35C4WN Stratix® V GX FPGA.