5SGXMA5H3F35C4N

The 5SGXMA5H3F35C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a commercial temperature grade. It delivers a high-capacity programmable fabric with 490,000 logic elements and approximately 46 Mbits of embedded RAM, enabling complex, high-density logic and memory-intensive designs.

Designed for board-level integration, this surface-mount device provides 552 user I/Os and is supplied in a 1152-ball BGA/FBGA (35×35) package. Its operating range and supply requirements make it suitable for commercial electronic systems that require substantial programmable resources and I/O connectivity.

Key Features

• Core Capacity  490,000 logic elements to implement large-scale programmable logic, custom datapaths, and parallel processing engines.
• Embedded Memory  Approximately 46 Mbits of total on-chip RAM to support buffering, FIFOs, and large state machines without external memory.
• I/O Resources  552 user I/Os for extensive board-level interfacing, enabling numerous high-density peripheral connections and multi-channel designs.
• Package & Mounting  Available in a 1152-BBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Power  Core supply specified between 820 mV and 880 mV, enabling predictable core-voltage design and power provisioning.
• Temperature & Grade  Commercial grade with an operating temperature range of 0°C to 85°C for mainstream electronics and commercial systems.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density programmable logic  Implement large custom logic networks and parallel processing tasks that benefit from 490k logic elements and extensive on-chip RAM.
• Memory-intensive designs  Use on-chip RAM (approximately 46 Mbits) for buffering, lookup tables, and embedded state storage to reduce external memory dependency.
• Complex I/O systems  Integrate multiple peripherals or channels on a single FPGA using the 552 available I/Os for dense board-level connectivity.
• Commercial electronics  Deploy in commercial-temperature applications where the device’s specified operating range and commercial grade are appropriate.

Unique Advantages

• Large programmable fabric: 490,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, simplifying system architecture.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces reliance on external memory components, lowering BOM complexity and board routing.
• High I/O density: 552 I/Os enable broad peripheral integration and flexible interfacing options for multi-channel or multi-board systems.
• Commercial-temperature rating: Rated 0°C to 85°C to match typical commercial product environments and deployment scenarios.
• Surface-mount BGA packaging: 1152-ball BGA/FBGA (35×35) package supports standard PCB manufacturing and dense system-level placement.
• Regulatory compliance: RoHS compliance facilitates integration into lead-free manufacturing flows.

Why Choose 5SGXMA5H3F35C4N?

The 5SGXMA5H3F35C4N combines a high logic element count, significant on-chip RAM, and a large I/O complement in a compact 1152-ball BGA package, making it well suited for commercial designs that require integration of complex logic and substantial memory resources. Its defined core voltage window and commercial operating temperature make power and thermal planning straightforward for board-level designs.

This Stratix V GX device is appropriate for engineers and teams consolidating multiple functions into a single FPGA fabric—reducing component count and simplifying system partitioning—while maintaining clear, verifiable specifications for performance and integration.

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