5SGXMA5H3F35C3WN

The 5SGXMA5H3F35C3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offering a high-density programmable-logic fabric in a 1152-BBGA FCBGA package. It delivers 490,000 logic elements and approximately 46 Mbits of embedded memory, combined with 552 user I/Os for designs that require substantial on-chip resources and I/O connectivity.

This commercial-grade device is optimized for surface-mount assembly and operates across a supply voltage range of 820 mV to 880 mV and an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  490,000 logic elements to implement complex programmable logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and storage of intermediate data.
• I/O Density  552 I/O pins to support wide parallel interfaces, multi-channel connectivity, and high pin-count system designs.
• Package & Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) designed for surface-mount PCB assembly in compact, high-density layouts.
• Power  Rated supply voltage range of 820 mV to 880 mV to match platform power-rail design points.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and environmental sourcing requirements.

Typical Applications

• High-density digital processing  Implement large custom datapaths, accelerators, or signal-processing pipelines using extensive logic and embedded memory.
• I/O-intensive systems  Support multi-channel or wide parallel interfaces where 552 user I/Os enable rich connectivity to peripherals and daughtercards.
• Prototyping and product development  Deploy as a programmable platform for validating high-complexity hardware architectures and firmware/software integration.
• System integration  Consolidate multiple functions into a single FPGA to reduce board-level component count and simplify interconnect.

Unique Advantages

• High logic capacity: 490,000 logic elements provide the headroom to implement large-scale designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM supports large buffers and on-FPGA data storage to reduce external memory dependence.
• Extensive I/O count: 552 I/Os enable flexible interface options and parallel connectivity for complex systems.
• Compact package: 1152-BBGA FCBGA packaging delivers high pin count in a compact footprint suitable for densely populated PCBs.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to match standard commercial applications and deployments.
• Regulatory readiness: RoHS compliance supports environmentally conscious product builds and supply-chain requirements.

Why Choose 5SGXMA5H3F35C3WN?

The 5SGXMA5H3F35C3WN pairs a large logic fabric with substantial embedded memory and a high I/O count in a compact FCBGA package—making it suitable for designs that require dense, high-capacity programmable logic and extensive interfacing. As a commercial-grade Stratix V GX FPGA, it is appropriate for development and deployment in systems where on-chip resources, I/O density, and package integration are key selection criteria.

Choosing this device offers a balance of capacity and integration that supports scalable design approaches, consolidation of board-level functions, and engineering workflows that leverage on-chip memory and I/O to simplify system architecture.

Request a quote or submit your requirements to get pricing and availability information for the 5SGXMA5H3F35C3WN FPGA.