5SGXMA5H3F35C2WN

The 5SGXMA5H3F35C2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152-BBGA surface-mount package. It combines very high logic density with large on-chip embedded memory and a high I/O count for complex, I/O‑intensive digital designs.

Designed as a commercial-grade device, this FPGA offers a combination of performance and integration for applications that require substantial programmable logic, abundant embedded RAM, and wide I/O connectivity within a compact 1152-FBGA (35×35 mm) package.

Key Features

• High logic capacity  Approximately 490,000 logic elements to implement large-scale digital functions and complex control or datapath logic.
• Substantial embedded memory  Approximately 46 Mbits of on-chip RAM for buffers, FIFOs, and storage for performance-critical designs.
• Extensive I/O  552 I/O pins to support wide parallel interfaces, board-level connectivity, and multi-protocol front-ends.
• Package and mounting  Surface-mount 1152-FBGA package (35×35 mm) for high-density board implementation and reliable solder mounting.
• Power supply range  Core voltage operating range from 870 mV to 930 mV to match system power-rail planning and thermal budgets.
• Commercial operating grade  Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
• RoHS compliant  Meets RoHS requirements for environmentally conscious manufacturing.

Typical Applications

• High-density digital processing  Large logic element count and abundant embedded RAM support complex signal processing, custom accelerators, and algorithm implementation.
• Networking and communications  High I/O count and Stratix V GX family transceiver capability make the device suitable for board-level packet processing, interface bridging, and protocol offload.
• System integration and prototyping  Compact 1152-FBGA packaging and surface-mount mounting facilitate integration into prototype and production PCBs where board space is constrained.

Unique Advantages

• Large programmable fabric: Approximately 490,000 logic elements provide the capacity needed to consolidate multiple functions into a single device and reduce BOM complexity.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for buffering and data paths, improving throughput and latency.
• High I/O density: 552 I/Os enable flexible interfacing with peripherals, high-speed connectors, and parallel buses without additional bridging logic.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream electronic products and applications where commercial-grade operation is required.
• Compact, manufacturable package: 1152-FBGA (35×35 mm) supports dense board layouts while remaining compatible with standard surface-mount assembly processes.
• Vendor-backed documentation: Part of the Stratix V family with published electrical and switching characteristics to support design validation and system integration.

Why Choose 5SGXMA5H3F35C2WN?

The 5SGXMA5H3F35C2WN positions itself as a high-capacity, I/O-rich Stratix V GX FPGA suited to designs that require substantial programmable logic, large embedded memory, and broad board-level connectivity. Its commercial-grade rating and compact 1152-FBGA package make it appropriate for demanding mainstream applications where consolidation of functions and high integration are priorities.

For engineering teams targeting complex digital systems—such as datapath acceleration, protocol processing, or advanced integration tasks—this FPGA delivers the resources needed to scale designs while relying on Intel’s Stratix V family documentation for electrical and switching reference.

Request a quote or submit an inquiry to receive pricing and availability for part number 5SGXMA5H3F35C2WN.