5SGXMA5H3F35C2N

The 5SGXMA5H3F35C2N is a Stratix V GX field programmable gate array (FPGA) IC designed for commercial-temperature applications. It integrates 490,000 logic elements and approximately 46.08 Mbits of on-chip RAM with 552 available I/O pins in a 1152-FBGA (35×35) surface-mount package.

Documentation for the Stratix V family covers electrical and switching characteristics including transceiver specifications, core and periphery performance, and I/O timing. The device operates at a core supply range of 870 mV to 930 mV and is rated for 0 °C to 85 °C; it is RoHS compliant.

Key Features

• Core Capacity  490,000 logic elements for implementing large-scale digital logic and custom datapaths.
• Embedded Memory  Approximately 46.08 Mbits of total on-chip RAM to support complex buffering, FIFOs, and local storage without external memory.
• I/O Density  552 user I/O pins to interface with high-channel-count peripherals, buses, and parallel interfaces.
• Power and Voltage  Core supply specified between 870 mV and 930 mV to meet the Stratix V electrical operating requirements.
• Package and Mounting  1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35) for compact, high-density board designs.
• Temperature Grade  Commercial grade with operating range 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Documentation Coverage  Datasheet material for the Stratix V family includes electrical characteristics, switching characteristics, transceiver and I/O timing information to support system-level design and validation.

Unique Advantages

• High logic density: 490,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing component count.
• Substantial on-chip RAM: Approximately 46.08 Mbits of embedded memory enable local data storage for high-throughput designs and reduce dependence on external memory.
• Extensive I/O availability: 552 I/Os support complex connectivity requirements and flexible board-level partitioning.
• Compact FCBGA package: The 1152-FBGA (35×35) package offers a high I/O-to-footprint ratio for space-constrained designs.
• Low-voltage core operation: 0.87 V–0.93 V core supply allows integration with modern low-voltage power architectures.
• Commercial thermal range and RoHS compliance: Suitable for commercial-temperature applications with environmental compliance for mainstream product manufacturing.

Why Choose 5SGXMA5H3F35C2N?

The 5SGXMA5H3F35C2N positions itself as a high-capacity Stratix V GX FPGA for commercial designs that require large logic resources, significant on-chip memory, and broad I/O connectivity in a compact FCBGA package. Its documented electrical and switching characteristics for the Stratix V family help engineers evaluate transceiver and I/O timing behavior alongside core performance.

This device is appropriate for development teams and system integrators targeting complex digital systems that need high integration density and extensive programmable resources while operating within commercial temperature limits. The combination of logic capacity, embedded RAM, and I/O count offers design scalability and consolidation potential across high-channel-count and memory-intensive designs.

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