5SGXMA5H2F35I3WN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 683 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5H2F35I3WN – Stratix V GX FPGA, 1152‑FBGA (35×35)

The 5SGXMA5H2F35I3WN is an Intel Stratix® V GX field-programmable gate array (FPGA) provided in a 1152‑FBGA (35×35) surface-mount package. Designed for high-density, configurable logic applications, this industrial‑grade device delivers a combination of abundant logic resources, on‑chip memory, and a large I/O complement for complex system designs.

Typical markets include high-performance communications, advanced embedded compute, and processing-intensive signal and data-path applications where scalability, integration, and extended temperature operation are required.

Key Features

  • Core logic  Approximately 490,000 logic elements (logic cells) for implementing large, complex logic functions and custom datapaths.
  • Embedded memory  Approximately 46 Mbits of on‑chip RAM to support buffering, look‑up tables, and memory‑intensive algorithms without external RAM.
  • I/O capacity  Up to 552 user I/O pins to support wide parallel interfaces and multiple high‑speed lanes.
  • Transceiver family capability  Stratix V GX family transceiver options (per device family documentation) include multi‑Gbps channel speed grades for scalable high‑speed serial connectivity.
  • Power and core supply  Core voltage supply range of 820 mV to 880 mV to match system power‑rail requirements and device speed/grade options.
  • Package & mounting  1152‑BBGA (FCBGA) supplier device package; 35×35 mm footprint; surface‑mount for standard PCB assembly.
  • Industrial temperature range  Rated for operation from −40 °C to 100 °C for extended‑temperature deployments.
  • RoHS compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • High‑performance networking  Implements complex packet processing, switching, and custom protocol logic requiring large logic density and many I/Os.
  • Telecom and wireless infrastructure  Supports baseband and fronthaul processing with family transceiver options suitable for multi‑Gbps serial links.
  • Video and broadcast processing  Enables real‑time image and video pipelines with on‑chip RAM for frame buffering and large logic resources for custom processing blocks.
  • Advanced embedded compute  Serves as a configurable accelerator or system controller for compute‑intensive tasks where tight integration and I/O bandwidth are critical.

Unique Advantages

  • High logic capacity: Approximately 490k logic elements enable integration of substantial custom logic and algorithmic functions on a single device, reducing system complexity.
  • Significant on‑chip RAM: Approximately 46 Mbits of embedded memory lowers dependence on external memory for buffering and state storage, improving latency and simplifying board design.
  • Large I/O count: 552 I/O pins provide flexibility to connect multiple peripherals, buses, and parallel interfaces without external multiplexing hardware.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in extended‑temperature environments.
  • Compact FCBGA package: 1152‑FBGA (35×35) package offers high pin density in a surface‑mount form factor for space‑constrained, high‑pin‑count designs.
  • Regulatory and supply readiness: RoHS compliance helps meet environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA5H2F35I3WN?

The 5SGXMA5H2F35I3WN delivers a compelling balance of logic density, embedded memory, and I/O capacity in an industrial‑rated Stratix V GX FPGA package. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of on‑chip RAM, and 552 user I/Os makes it well suited for complex, high‑bandwidth designs that require on‑device integration of large custom logic and buffering.

Engineers selecting this device benefit from Intel’s Stratix V GX family capabilities, a high‑pin‑count FCBGA package for dense routing, and industrial temperature operation for robust deployment. The device is appropriate for projects where integration, scalability, and extended‑temperature reliability are priorities.

Request a quote or contact sales for pricing, availability, and delivery options tailored to your design requirements.

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