5SGXMA5H2F35I3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 683 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5H2F35I3WN – Stratix V GX FPGA, 1152‑FBGA (35×35)
The 5SGXMA5H2F35I3WN is an Intel Stratix® V GX field-programmable gate array (FPGA) provided in a 1152‑FBGA (35×35) surface-mount package. Designed for high-density, configurable logic applications, this industrial‑grade device delivers a combination of abundant logic resources, on‑chip memory, and a large I/O complement for complex system designs.
Typical markets include high-performance communications, advanced embedded compute, and processing-intensive signal and data-path applications where scalability, integration, and extended temperature operation are required.
Key Features
- Core logic Approximately 490,000 logic elements (logic cells) for implementing large, complex logic functions and custom datapaths.
- Embedded memory Approximately 46 Mbits of on‑chip RAM to support buffering, look‑up tables, and memory‑intensive algorithms without external RAM.
- I/O capacity Up to 552 user I/O pins to support wide parallel interfaces and multiple high‑speed lanes.
- Transceiver family capability Stratix V GX family transceiver options (per device family documentation) include multi‑Gbps channel speed grades for scalable high‑speed serial connectivity.
- Power and core supply Core voltage supply range of 820 mV to 880 mV to match system power‑rail requirements and device speed/grade options.
- Package & mounting 1152‑BBGA (FCBGA) supplier device package; 35×35 mm footprint; surface‑mount for standard PCB assembly.
- Industrial temperature range Rated for operation from −40 °C to 100 °C for extended‑temperature deployments.
- RoHS compliant Manufactured in compliance with RoHS requirements.
Typical Applications
- High‑performance networking Implements complex packet processing, switching, and custom protocol logic requiring large logic density and many I/Os.
- Telecom and wireless infrastructure Supports baseband and fronthaul processing with family transceiver options suitable for multi‑Gbps serial links.
- Video and broadcast processing Enables real‑time image and video pipelines with on‑chip RAM for frame buffering and large logic resources for custom processing blocks.
- Advanced embedded compute Serves as a configurable accelerator or system controller for compute‑intensive tasks where tight integration and I/O bandwidth are critical.
Unique Advantages
- High logic capacity: Approximately 490k logic elements enable integration of substantial custom logic and algorithmic functions on a single device, reducing system complexity.
- Significant on‑chip RAM: Approximately 46 Mbits of embedded memory lowers dependence on external memory for buffering and state storage, improving latency and simplifying board design.
- Large I/O count: 552 I/O pins provide flexibility to connect multiple peripherals, buses, and parallel interfaces without external multiplexing hardware.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in extended‑temperature environments.
- Compact FCBGA package: 1152‑FBGA (35×35) package offers high pin density in a surface‑mount form factor for space‑constrained, high‑pin‑count designs.
- Regulatory and supply readiness: RoHS compliance helps meet environmental requirements for modern electronics manufacturing.
Why Choose 5SGXMA5H2F35I3WN?
The 5SGXMA5H2F35I3WN delivers a compelling balance of logic density, embedded memory, and I/O capacity in an industrial‑rated Stratix V GX FPGA package. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of on‑chip RAM, and 552 user I/Os makes it well suited for complex, high‑bandwidth designs that require on‑device integration of large custom logic and buffering.
Engineers selecting this device benefit from Intel’s Stratix V GX family capabilities, a high‑pin‑count FCBGA package for dense routing, and industrial temperature operation for robust deployment. The device is appropriate for projects where integration, scalability, and extended‑temperature reliability are priorities.
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