5SGXMA5H2F35I3N

The 5SGXMA5H2F35I3N is a Stratix V GX family FPGA in a 1152-BBGA (FCBGA) package, offered in an industrial temperature grade. It provides a large programmable fabric and peripheral resources for designs requiring substantial logic capacity, dense I/O, and on-chip embedded memory.

Key device attributes include approximately 490,000 logic elements (documented as 185,000 logic blocks), roughly 46 Mbits of embedded memory, and 552 I/O pins—making the device suitable for complex, memory- and I/O-heavy programmable logic implementations that must operate across a –40 °C to 100 °C temperature range.

Key Features

• Logic Capacity  Approximately 490,000 logic elements, corresponding to the part’s large programmable fabric for implementing complex digital functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM (46,080,000 total RAM bits) to support buffering, large state machines, and memory-intensive processing.
• High I/O Count  552 general-purpose I/O pins to support dense external interfacing and multi-channel connectivity.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet industrial application environmental requirements.
• Low-Voltage Core  Core voltage supply specified between 820 mV and 880 mV for the device core power domain.
• Package and Mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA format for high-pin-count board designs.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital logic  Implement large custom state machines, datapaths, and protocol engines using the device’s ~490,000 logic elements and extensive on-chip RAM.
• Memory-intensive processing  Leverage approximately 46 Mbits of embedded memory for buffering, packet processing, and data aggregation tasks.
• Dense I/O systems  Use 552 I/O pins to connect to multiple peripherals, high-channel-count front-ends, or parallel interfaces in industrial systems.
• Industrial embedded systems  Deploy in applications requiring operation across –40 °C to 100 °C, benefiting from the device’s industrial grade and surface-mount FCBGA package.

Unique Advantages

• Large programmable fabric: Enables integration of complex logic and multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O availability: 552 I/O pins support high channel counts and flexible interfacing without immediate need for I/O expanders.
• Industrial temperature rating: Operation from –40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact high-pin-count package: 1152-BBGA (35×35 FCBGA) provides a dense, surface-mount solution for space-constrained PCBs while preserving routing density.
• Standards-aligned supply domain: Core voltage specified at 820–880 mV enables integration with modern low-voltage power architectures.

Why Choose 5SGXMA5H2F35I3N?

The 5SGXMA5H2F35I3N delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade Stratix V GX FPGA. These attributes make it well suited for designers who need to consolidate complex digital functions, support memory-heavy data paths, and interface to many external signals within a single programmable device.

For engineering teams targeting demanding embedded and industrial applications, this FPGA offers a scalable, high-density platform with a proven device family foundation and specifications that support robust, long-term deployments.

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