5SGXMA5H2F35I3LG

The 5SGXMA5H2F35I3LG is a Stratix V GX family FPGA in a 1152-BBGA (FCBGA) package designed for high-density programmable logic and I/O integration. It combines a large count of logic elements and embedded memory with industrial temperature grading for demanding electronic systems.

This device is suited for designs that require substantial on-chip logic, abundant I/O, and configurable transceiver capability as defined by the Stratix V GX datasheet.

Key Features

• Logic Density  Approximately 490,000 logic elements (cells) for large-scale, programmable digital logic integration.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
• I/O Capacity  552 dedicated I/O pins to support wide parallel interfaces and extensive external connectivity.
• Package & Mounting  1152-ball BBGA FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount design for board-level integration.
• Voltage Supply  Core operating range from 820 mV to 880 mV for system power planning and regulation.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment applications.
• Family Transceiver Capability (from datasheet)  Part of the Stratix V GX family; datasheet lists GX transceiver speed-grade options (series documentation provides transceiver speed information).
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic element count and on-chip memory to implement complex state machines, signal processing pipelines, and hardware accelerators.
• High-bandwidth I/O and transceiver designs  Leverage the 552 I/O and Stratix V GX family transceiver capabilities for communications and data transport subsystems.
• Embedded and industrial control  Industrial temperature grading and broad I/O support make the device suitable for embedded controllers and automation equipment.

Unique Advantages

• High logic and memory integration: Combines ~490,000 logic elements with ~46 Mbits of embedded RAM to reduce external component count and simplify board design.
• Extensive I/O capability: 552 I/O pins provide flexibility for wide buses, multi-interface systems, and dense connector implementations.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation in extended-temperature environments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) offers a high-pin-count solution in a compact footprint for space-constrained PCBs.
• Power planning clarity: Defined core voltage range (820 mV–880 mV) assists system-level power supply design and verification.
• Standards-compliant supply chain: RoHS compliance supports environmentally constrained manufacturing requirements.

Why Choose 5SGXMA5H2F35I3LG?

The 5SGXMA5H2F35I3LG delivers a high-density Stratix V GX FPGA implementation with a large logic element count, substantial embedded memory, and a high I/O count in a compact 1152-BBGA FCBGA package. Its industrial temperature rating and defined core voltage range make it suitable for robust designs where integration, scalability, and environmental resilience are required.

Engineers designing complex digital systems, high-bandwidth I/O platforms, or industrial embedded controllers will find this device appropriate for applications that need a combination of logic capacity, on-chip memory, and flexible I/O in a single package.

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