5SGXMA5H2F35I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 748 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5H2F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA5H2F35I2N is a Stratix V GX family FPGA in a high-density FCBGA package designed for complex, high-capacity programmable logic designs. It combines a large logic element count, substantial on-chip memory, and a high I/O pin count in an industrial-grade device footprint.
Key value points include a high number of logic elements, approximately 46 Mbits of embedded memory, industrial temperature rating, and a compact 1152‑FBGA (35×35) surface-mount package for space-constrained board designs.
Key Features
- Core and Logic 490,000 logic elements (logic cells) to implement large-scale programmable logic and custom datapaths.
- Embedded Memory Approximately 46 Mbits of on-chip RAM (46,080,000 total RAM bits) for buffering, FIFOs, and memory-intensive logic.
- I/O Density 552 device I/O pins to support wide parallel interfaces and dense connectivity.
- Power and Voltage Core supply operating range from 870 mV to 930 mV for the device core rail.
- Package & Mounting 1152‑BBGA (FCBGA) supplier package: 1152‑FBGA (35×35); surface-mount mounting for high-density PCB assembly.
- Temperature & Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for extended-environment deployment.
- Regulatory RoHS compliant for lead-free assembly and regulatory compatibility.
Unique Advantages
- High programmable capacity: 490,000 logic elements enable implementation of large, complex designs without external logic expansion.
- Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- High I/O count: 552 I/O pins provide flexibility for interfacing multiple parallel buses, sensors, or high-pin-count peripherals.
- Industrial operating range: Rated from –40 °C to 100 °C for deployment in demanding temperature environments.
- Compact, high-density package: 1152‑FBGA (35×35) FCBGA in a surface-mount form factor supports high-pin-count designs while conserving board area.
- Low-voltage core operation: 870–930 mV supply range supports modern low-voltage FPGA core architectures.
Why Choose 5SGXMA5H2F35I2N?
As a member of the Stratix V GX family, the 5SGXMA5H2F35I2N delivers a balance of large programmable capacity, significant embedded memory, and high I/O density in an industrial-grade package. These attributes suit designs that require dense logic, on-chip memory resources, and extensive external interfacing while operating across extended temperature ranges.
The device is supported by Stratix V family documentation (device datasheet) and is supplied in a high-density 1152‑FBGA surface-mount package, offering a clear path for integration into space- and performance-constrained hardware designs.
Request a quote or submit a pricing and availability inquiry to begin procurement of 5SGXMA5H2F35I2N. Provide your quantity and delivery requirements to receive current pricing and lead-time information.

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