5SGXMA5H2F35I2N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 748 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5H2F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA5H2F35I2N is a Stratix V GX family FPGA in a high-density FCBGA package designed for complex, high-capacity programmable logic designs. It combines a large logic element count, substantial on-chip memory, and a high I/O pin count in an industrial-grade device footprint.

Key value points include a high number of logic elements, approximately 46 Mbits of embedded memory, industrial temperature rating, and a compact 1152‑FBGA (35×35) surface-mount package for space-constrained board designs.

Key Features

  • Core and Logic 490,000 logic elements (logic cells) to implement large-scale programmable logic and custom datapaths.
  • Embedded Memory Approximately 46 Mbits of on-chip RAM (46,080,000 total RAM bits) for buffering, FIFOs, and memory-intensive logic.
  • I/O Density 552 device I/O pins to support wide parallel interfaces and dense connectivity.
  • Power and Voltage Core supply operating range from 870 mV to 930 mV for the device core rail.
  • Package & Mounting 1152‑BBGA (FCBGA) supplier package: 1152‑FBGA (35×35); surface-mount mounting for high-density PCB assembly.
  • Temperature & Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for extended-environment deployment.
  • Regulatory RoHS compliant for lead-free assembly and regulatory compatibility.

Unique Advantages

  • High programmable capacity: 490,000 logic elements enable implementation of large, complex designs without external logic expansion.
  • Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • High I/O count: 552 I/O pins provide flexibility for interfacing multiple parallel buses, sensors, or high-pin-count peripherals.
  • Industrial operating range: Rated from –40 °C to 100 °C for deployment in demanding temperature environments.
  • Compact, high-density package: 1152‑FBGA (35×35) FCBGA in a surface-mount form factor supports high-pin-count designs while conserving board area.
  • Low-voltage core operation: 870–930 mV supply range supports modern low-voltage FPGA core architectures.

Why Choose 5SGXMA5H2F35I2N?

As a member of the Stratix V GX family, the 5SGXMA5H2F35I2N delivers a balance of large programmable capacity, significant embedded memory, and high I/O density in an industrial-grade package. These attributes suit designs that require dense logic, on-chip memory resources, and extensive external interfacing while operating across extended temperature ranges.

The device is supported by Stratix V family documentation (device datasheet) and is supplied in a high-density 1152‑FBGA surface-mount package, offering a clear path for integration into space- and performance-constrained hardware designs.

Request a quote or submit a pricing and availability inquiry to begin procurement of 5SGXMA5H2F35I2N. Provide your quantity and delivery requirements to receive current pricing and lead-time information.

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