5SGXMA5H2F35C3WN

The 5SGXMA5H2F35C3WN is a Stratix V GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package optimized for high-density, high-bandwidth digital designs. This commercial-grade device provides a large programmable fabric with 490,000 logic elements and approximately 46 Mbits of embedded memory, supporting complex logic, buffering and data-path implementations.

With 552 available I/Os, a 35 × 35 mm 1152-FBGA footprint, and a low core voltage range of 820 mV to 880 mV, the device is targeted at applications that require high integration, substantial on-chip RAM and significant I/O capability within a surface-mount package.

Key Features

• Core Logic  490,000 logic elements for implementing large-scale digital designs and complex programmable logic.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support wide buffering, LUT storage and memory-intensive processing.
• I/O Capacity  552 I/Os to accommodate broad peripheral, bus and multi-channel interfaces directly on-chip.
• Package  1152-ball BGA (FCBGA) in a 35 × 35 mm supplier device package (1152-FBGA) suitable for high-density PCB assembly; surface-mount mounting type.
• Power  Core supply voltage rated from 820 mV to 880 mV, enabling designs targeting low-voltage FPGA core operation.
• Temperature Range  Commercial operating temperature range from 0 °C to 85 °C for standard commercial applications.
• Compliance  RoHS-compliant to support environmental and regulatory requirements.

Typical Applications

• High-density FPGA-based systems  Implement large programmable logic designs that require hundreds of thousands of logic elements and substantial embedded RAM.
• Multi-channel I/O and interface aggregation  Leverage 552 I/Os to consolidate multiple interfaces and high pin-count peripherals on a single device.
• Compute acceleration and data-path processing  Use on-chip RAM and dense logic fabric for buffering, custom compute engines and data-flow acceleration.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of large and complex designs without splitting functionality across multiple devices.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT requirements.
• Extensive I/O resources: 552 I/Os provide flexibility for integrating multiple high-pin-count interfaces or parallel channels directly to the FPGA.
• Compact, assembly-friendly package: 1152-FBGA (35 × 35 mm) surface-mount package facilitates high-density PCB layouts while keeping the design footprint controlled.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports low-voltage power domains common in modern system architectures.
• Commercial grade and RoHS compliant: Designed for standard commercial temperature operation and meets RoHS environmental requirements.

Why Choose 5SGXMA5H2F35C3WN?

The 5SGXMA5H2F35C3WN positions itself where high logic capacity, significant embedded memory and large I/O counts are required in a single commercial-grade FPGA package. Its combination of 490,000 logic elements, roughly 46 Mbits of on-chip RAM and 552 I/Os in a 1152-ball FCBGA footprint makes it suitable for dense digital systems that demand integration and flexibility.

For teams designing scalable, memory- and I/O-intensive FPGA implementations, this Stratix V GX device offers the core specifications needed to consolidate functions, reduce external component count and support complex data-paths while operating within standard commercial temperature and RoHS-compliant constraints.

Request a quote or submit a purchasing inquiry to evaluate the 5SGXMA5H2F35C3WN for your next high-density FPGA design.