5SGXMA5H3F35I3LN

The 5SGXMA5H3F35I3LN is an Intel Stratix® V GX FPGA device in an industrial-grade, surface-mount FCBGA package. It provides high logic density and embedded RAM to implement complex programmable logic, with on-chip resources and I/O capacity suitable for demanding systems.

Key architectural points include approximately 490,000 logic elements, roughly 46.08 Mbits of embedded memory, and 552 general-purpose I/O pins. The device is rated for industrial operating temperatures from −40 °C to 100 °C and supports a core supply range of 820 mV to 880 mV.

Key Features

• Core Logic  Approximately 490,000 logic elements for high-density custom logic and data-path implementations.
• Embedded Memory  Approximately 46.08 Mbits (46,080,000 bits) of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions.
• Programmable I/O  Up to 552 I/O pins to interface with a wide range of external peripherals and high-pin-count systems.
• Power and Voltage  Core voltage supply specified between 820 mV and 880 mV to match system power rails and power budgeting needs.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35), surface-mount for board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High-speed serial interfaces  Use the Stratix V GX family device characteristics to implement multi-gigabit transceivers and custom protocol endpoints.
• High-density logic integration  Deploy the device where a large count of logic elements and on-chip RAM are required for complex algorithms and data processing.
• Board-level I/O expansion  Leverage 552 I/O pins to consolidate peripheral interfaces and reduce external glue logic on populated PCBs.

Unique Advantages

• High logic capacity: 490,000 logic elements enable sizable custom logic and parallel processing implementations without immediate need for multiple devices.
• Substantial on-chip RAM: Approximately 46.08 Mbits of embedded memory reduces dependence on external memory for many buffering and caching use cases.
• Extensive I/O count: 552 I/O pins provide flexibility for wide buses, multi-channel interfaces, and dense system integration.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in thermally challenging or industrial environments.
• Compact BGA package: 1152-ball FCBGA (35×35) offers a high I/O to board-area ratio for space-constrained designs.
• Regulatory readiness: RoHS compliance helps simplify environmental and materials planning for production builds.

Why Choose 5SGXMA5H3F35I3LN?

This Stratix V GX FPGA delivers a combination of high logic density, significant embedded RAM, and a large I/O complement in an industrial-grade FCBGA package. The device is intended for projects that require substantial programmable resources and reliable operation across a wide temperature range.

Designers and engineers targeting high-performance logic, multi-gigabit interfacing, or consolidated board-level systems will find the 5SGXMA5H3F35I3LN suited to dense, demanding implementations while benefiting from Intel’s Stratix V device family documentation and specifications.

Request a quote or submit a pricing and availability inquiry to evaluate 5SGXMA5H3F35I3LN for your next design.