5SGXMA5H3F35I4G

The 5SGXMA5H3F35I4G is a Stratix V GX field programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package. It delivers a high logic capacity of 490,000 logic elements and approximately 46.08 Mbits of embedded memory for designs that require substantial on‑chip resources and extensive I/O.

Built for industrial temperature operation and designed with configurable core and I/O attributes documented in the Stratix V device datasheet, this device is suited to systems that need dense programmable logic, large embedded RAM, and a high pin count in a surface‑mount FCBGA package.

Key Features

• Logic Capacity – 490,000 logic elements to implement large, complex designs and significant programmable logic functionality.
• Embedded Memory – Approximately 46.08 Mbits of on‑chip RAM to support buffering, storage, and data‑path acceleration without external memory.
• I/O Density – 552 user I/O pins to interface with multiple external devices, buses, and peripherals.
• Core Voltage Supply – Core supply range of 820 mV to 880 mV for defined power planning and delivery requirements.
• Package and Mounting – 1152‑BBGA, FCBGA package (supplier package 1152‑FBGA, 35 × 35 mm) with surface‑mount mounting for compact board integration.
• Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C to meet industrial environment demands.
• Design and Timing Resources – Device family datasheet documents electrical and switching characteristics including transceiver specifications and I/O timing for system design and signal integrity planning.
• Environmental Compliance – RoHS‑compliant to support regulatory and environmental requirements.

Typical Applications

• High‑density programmable logic systems – Implement complex algorithms and custom data paths using large logic capacity and on‑chip RAM.
• Systems requiring extensive I/O – Integrate multiple external interfaces and peripherals using the 552 user I/O pins.
• Industrial electronics – Deploy in equipment operating across −40 °C to 100 °C where industrial temperature grading is required.
• Platform prototyping and system integration – Use the device’s dense resources and documented electrical/switching characteristics for board‑level system development and validation.

Unique Advantages

• Large programmable fabric: 490,000 logic elements provide the capacity to consolidate multiple functions into a single device and reduce BOM complexity.
• Substantial on‑chip memory: Approximately 46.08 Mbits of embedded RAM enables significant buffering and data storage without immediate dependence on external memories.
• High I/O count: 552 I/O pins simplify external connectivity and allow flexible interfacing to peripherals and high‑pin‑count subsystems.
• Industrial temperature range: Rated −40 °C to 100 °C for reliable operation in demanding environments.
• Compact FCBGA packaging: 1152‑BBGA (35 × 35 mm) surface‑mount package balances high pin count with board space efficiency.
• Standards‑aware design data: Electrical and switching characteristics including transceiver and I/O timing are documented in the Stratix V device datasheet to support engineering verification and integration.

Why Choose 5SGXMA5H3F35I4G?

The 5SGXMA5H3F35I4G positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA option for designs that require substantial programmable logic, ample embedded RAM, and a large number of I/Os in a compact FCBGA package. Its defined core voltage range and documented device characteristics support disciplined power, signal integrity, and thermal planning.

This part is suitable for engineering teams building complex, board‑level systems where integration of multiple functions into a single FPGA, predictable electrical behavior, and industrial temperature operation are priorities. The combination of logic density, embedded memory, and I/O scalability provides long‑term design flexibility and scope for future feature growth.

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