5SGXMA5K1F35C1G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,402 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K1F35C1G – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA5K1F35C1G is a Stratix V GX field programmable gate array (FPGA) IC delivering a large logic capacity and substantial on‑chip memory for demanding programmable logic designs. This commercial‑grade Stratix V GX device combines extensive logic resources, abundant embedded RAM, and rich I/O to support high‑density, high‑bandwidth system designs.
Engineered for surface‑mount board implementations in a 1152‑ball FCBGA package, the device is suited to designs that require a high count of logic elements, significant embedded memory, and numerous I/O pins while operating within a 0 °C to 85 °C commercial temperature range.
Key Features
- Core Logic Capacity Approximately 490,000 logic elements to implement large, complex logic designs and system functions.
- Embedded Memory Approximately 46 Mbits of on‑chip RAM for large buffering, lookup tables, and state storage.
- I/O Resources 432 general‑purpose I/O pins to support wide external interfacing and parallel connections.
- Package & Mounting 1152‑BBGA / 1152‑FBGA (35×35) package in a surface‑mount form factor for compact board integration.
- Power and Core Voltage Core supply range 870 mV to 930 mV to match system power rails and regulator designs.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for standard commercial environments.
- Standards and Compliance RoHS‑compliant manufacturing.
Typical Applications
- High‑speed communications Large logic capacity and generous on‑chip memory support protocol processing and packet handling in transceiver‑based systems.
- Data center and networking Abundant I/O and memory enable hardware acceleration, packet buffering, and interface aggregation tasks.
- Signal processing and FPGA‑based acceleration Extensive logic resources and embedded RAM facilitate complex DSP pipelines and algorithm acceleration.
- Prototyping and system integration High logic element count and flexible I/O make the device suitable for developing and validating custom silicon functions.
Unique Advantages
- High logic density: Approximately 490,000 logic elements provide the capacity to implement large, multi‑function designs on a single device.
- Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage needs.
- Extensive external interfacing: 432 I/O pins enable broad connectivity options for parallel data paths and multiple peripheral interfaces.
- Compact, manufacturable package: 1152‑ball FCBGA (35×35) surface‑mount package supports dense board layouts while maintaining manufacturability.
- Commercial operating range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
- RoHS compliance: Environmentally compliant manufacturing supports regulatory and supply‑chain requirements.
Why Choose 5SGXMA5K1F35C1G?
The 5SGXMA5K1F35C1G balances very large programmable logic capacity with substantial embedded memory and broad I/O in a single commercial‑grade Stratix V GX FPGA. Its specification set—hundreds of thousands of logic elements, tens of megabits of on‑chip RAM, 432 I/Os, and a compact 1152‑ball FCBGA package—makes it a practical choice for designs that demand high integration and flexibility without moving to multiple discrete components.
This device is well suited to engineering teams developing high‑bandwidth communications systems, data‑plane accelerators, and complex signal processing solutions that require scalable logic resources, on‑chip storage, and dense I/O within standard commercial temperature and supply constraints.
Request a quote or submit an inquiry to check availability, lead times, and pricing for the 5SGXMA5K1F35C1G to support your next FPGA‑based design.

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