5SGXMA5K1F35C1G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 1,402 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K1F35C1G – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA5K1F35C1G is a Stratix V GX field programmable gate array (FPGA) IC delivering a large logic capacity and substantial on‑chip memory for demanding programmable logic designs. This commercial‑grade Stratix V GX device combines extensive logic resources, abundant embedded RAM, and rich I/O to support high‑density, high‑bandwidth system designs.

Engineered for surface‑mount board implementations in a 1152‑ball FCBGA package, the device is suited to designs that require a high count of logic elements, significant embedded memory, and numerous I/O pins while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Logic Capacity  Approximately 490,000 logic elements to implement large, complex logic designs and system functions.
  • Embedded Memory  Approximately 46 Mbits of on‑chip RAM for large buffering, lookup tables, and state storage.
  • I/O Resources  432 general‑purpose I/O pins to support wide external interfacing and parallel connections.
  • Package & Mounting  1152‑BBGA / 1152‑FBGA (35×35) package in a surface‑mount form factor for compact board integration.
  • Power and Core Voltage  Core supply range 870 mV to 930 mV to match system power rails and regulator designs.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial environments.
  • Standards and Compliance  RoHS‑compliant manufacturing.

Typical Applications

  • High‑speed communications  Large logic capacity and generous on‑chip memory support protocol processing and packet handling in transceiver‑based systems.
  • Data center and networking  Abundant I/O and memory enable hardware acceleration, packet buffering, and interface aggregation tasks.
  • Signal processing and FPGA‑based acceleration  Extensive logic resources and embedded RAM facilitate complex DSP pipelines and algorithm acceleration.
  • Prototyping and system integration  High logic element count and flexible I/O make the device suitable for developing and validating custom silicon functions.

Unique Advantages

  • High logic density: Approximately 490,000 logic elements provide the capacity to implement large, multi‑function designs on a single device.
  • Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage needs.
  • Extensive external interfacing: 432 I/O pins enable broad connectivity options for parallel data paths and multiple peripheral interfaces.
  • Compact, manufacturable package: 1152‑ball FCBGA (35×35) surface‑mount package supports dense board layouts while maintaining manufacturability.
  • Commercial operating range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
  • RoHS compliance: Environmentally compliant manufacturing supports regulatory and supply‑chain requirements.

Why Choose 5SGXMA5K1F35C1G?

The 5SGXMA5K1F35C1G balances very large programmable logic capacity with substantial embedded memory and broad I/O in a single commercial‑grade Stratix V GX FPGA. Its specification set—hundreds of thousands of logic elements, tens of megabits of on‑chip RAM, 432 I/Os, and a compact 1152‑ball FCBGA package—makes it a practical choice for designs that demand high integration and flexibility without moving to multiple discrete components.

This device is well suited to engineering teams developing high‑bandwidth communications systems, data‑plane accelerators, and complex signal processing solutions that require scalable logic resources, on‑chip storage, and dense I/O within standard commercial temperature and supply constraints.

Request a quote or submit an inquiry to check availability, lead times, and pricing for the 5SGXMA5K1F35C1G to support your next FPGA‑based design.

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