5SGXMA5K1F35C1WN

The 5SGXMA5K1F35C1WN is a Stratix V GX family FPGA from Intel, delivered in a 1152‑FBGA (35×35) surface‑mount package. It provides high logic density—approximately 490,000 logic elements—and substantial on‑chip memory—approximately 46 Mbits of embedded RAM—along with 432 general‑purpose I/O pins.

Designed for commercial‑grade systems, this device offers a defined core supply voltage range (870 mV to 930 mV) and an operating temperature range of 0 °C to 85 °C, making it suitable for high‑capacity, performance‑oriented digital designs that require large logic and memory resources in a compact BGA footprint.

Key Features

• Core Logic Density  Approximately 490,000 logic elements to implement large, complex logic functions within a single device.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, caching, and data storage close to logic for low‑latency data paths.
• I/O Capacity  432 I/O pins to support extensive external interfacing and parallel signal routing in dense system designs.
• Package & Mounting  1152‑FBGA (35×35) package, surface mount, enabling high‑density PCB integration and reliable BGA connectivity.
• Power Supply  Core supply voltage specified between 870 mV and 930 mV for predictable power planning and board‑level power design.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial applications and controlled‑environment systems.
• Standards Compliance  RoHS compliant, meeting common lead‑free and environmental requirements for manufacturing.

Typical Applications

• High‑density logic designs  Use the device where a large number of logic elements and embedded RAM are required to implement complex state machines, pipelines, or processing blocks.
• Systems requiring large I/O counts  Ideal for applications that need hundreds of general‑purpose signals routed to external devices or connectors thanks to 432 available I/Os.
• Compact board designs  The 1152‑FBGA package supports integration into space‑constrained PCBs while preserving high device capacity.

Unique Advantages

• High on‑chip logic capacity: Enables consolidation of large logic functions into a single FPGA, reducing the need for multiple devices and simplifying system architecture.
• Significant embedded memory: Approximately 46 Mbits of RAM provides on‑device storage for buffers and state, improving data locality and reducing external memory dependence.
• Large I/O surface: 432 I/Os facilitate broad connectivity options for parallel interfaces, sensor arrays, or multi‑lane external buses.
• Commercial temperature rating: Clear 0 °C to 85 °C operating range supports deployment in commercial environments with defined thermal conditions.
• BGA packaging for density: The 1152‑FBGA (35×35) package delivers a compact footprint for designs that require high integration without sacrificing pin count.
• RoHS compliant: Conforms to common environmental manufacturing standards for lead‑free production.

Why Choose 5SGXMA5K1F35C1WN?

This Stratix V GX FPGA combines very high logic density, substantial embedded memory, and a large I/O complement in a single commercial‑grade FBGA package. Its voltage and temperature specifications provide clear parameters for system power and thermal design, while the RoHS compliance supports environmentally conscious manufacturing.

The 5SGXMA5K1F35C1WN is well suited for engineers and system designers who need to implement complex digital designs with significant on‑chip resources and extensive external interfacing in a compact BGA footprint.

If you would like pricing, availability, or a formal quote for the 5SGXMA5K1F35C1WN, please submit a request or quote inquiry and include your desired quantity and delivery timeframe.