5SGXMA5K1F35C2G

The 5SGXMA5K1F35C2G is a Stratix V GX FPGA IC from Intel, built for high‑capacity programmable logic applications. It combines a large logic fabric with substantial on‑chip memory and high I/O density to address complex digital designs that require integrated logic, memory, and high‑speed serial interfaces.

Key attributes include approximately 490,000 logic elements, roughly 46.08 Mbits of embedded memory, 432 user I/Os, and a high‑density 1152‑BBGA FCBGA package. The device is offered in a commercial temperature grade with a 0 °C to 85 °C operating range and complies with RoHS.

Key Features

• Core Logic  Approximately 490,000 logic elements providing large-scale programmable logic capacity for complex control, processing, and glue‑logic tasks.
• On‑chip Memory  Approximately 46.08 Mbits of embedded RAM to support buffering, tables, and intermediate data storage without external memory for many functions.
• I/O Density  432 available I/Os to support wide parallel interfaces, multi‑lane connectivity, and extensive peripheral integration.
• High‑speed Transceiver Support  Stratix V GX devices support GX transceiver channel rates (up to 14.1 Gbps depending on speed grade), enabling high‑bandwidth serial links for communications and data transfer.
• Power and Voltage  Core supply specified from 870 mV to 930 mV to match system power‑rail budgets and core performance requirements.
• Package and Mounting  1152‑BBGA (35 × 35) FCBGA package in a surface‑mount form factor for compact, high‑density board designs.
• Commercial Grade and Temperature Range  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead‑free assemblies.

Typical Applications

• High‑speed networking and communications  Leverages GX transceiver capability and high I/O count to implement multi‑lane serial links and protocol bridging.
• Advanced digital signal processing  Large logic capacity and substantial on‑chip RAM support DSP pipelines, real‑time processing, and custom accelerator functions.
• System integration and prototyping  Dense I/O and programmable logic enable consolidation of glue logic, control, and peripheral interfaces on a single device during development and deployment.

Unique Advantages

• High logic capacity: The device’s ~490,000 logic elements permit complex logic implementation without partitioning across multiple FPGAs.
• Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Rich I/O and package density: 432 I/Os in a 1152‑BBGA package enable compact board layouts with extensive peripheral connectivity.
• High‑speed serial readiness: Stratix V GX transceiver support (up to 14.1 Gbps depending on speed grade) allows integration of high‑bandwidth links directly in the FPGA fabric.
• Commercial operating range: Rated for 0 °C to 85 °C operation, suitable for a wide range of standard commercial electronic products.
• Low‑voltage core: Core supply specification of 870 mV to 930 mV aligns with modern low‑voltage power distribution strategies.

Why Choose 5SGXMA5K1F35C2G?

The 5SGXMA5K1F35C2G delivers a balanced combination of large programmable logic, substantial embedded memory, and high I/O density in a compact FCBGA package. It is aimed at designers who require on‑chip resources to implement complex digital systems and high‑bandwidth serial interfaces within a commercial temperature envelope.

As a member of the Stratix V GX family from Intel, this device is specified with clear electrical and switching characteristics, making it suitable for projects that need verifiable logic capacity, memory resources, and transceiver capability while meeting RoHS requirements.

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