5SGXMA5K1F35C2WN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 254 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K1F35C2WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA5K1F35C2WN is a Stratix V GX series FPGA IC from Intel, delivered in a 1152‑FBGA (35×35) FCBGA package for surface-mount applications. This commercial‑grade device provides a dense logic fabric and substantial embedded memory suitable for complex, high‑capacity digital designs.

Key on‑chip resources include 490,000 logic elements and approximately 46.08 Mbits of embedded memory, paired with 432 user I/O pins. The device operates from a core supply of 870 mV to 930 mV and is specified for commercial operating temperatures from 0°C to 85°C.

Key Features

  • Core / Logic 490,000 logic elements (cells) to support large-scale programmable logic implementations.
  • Embedded Memory Approximately 46.08 Mbits of on‑chip RAM for buffering, FIFOs, and state storage without external memory.
  • I/O Density 432 I/O pins to accommodate multiple parallel interfaces and complex board-level routing.
  • Power Core voltage range of 870 mV to 930 mV to match low‑voltage power-rail architectures.
  • Package & Mounting 1152‑BBGA / FCBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact PCB integration.
  • Temperature & Grade Commercial grade with an operating temperature range of 0°C to 85°C.
  • Compliance RoHS compliant.
  • Documentation Electrical and switching characteristics for the Stratix V family—including I/O timing and core/periphery performance—are provided in the device datasheet.

Unique Advantages

  • High integration density: 490,000 logic elements combined with ~46.08 Mbits of embedded memory reduce the need for external components in complex designs.
  • Substantial I/O availability: 432 user I/O pins enable multiple interfaces and high‑channel-count systems without sacrificing board routing flexibility.
  • Compact FCBGA package: 1152‑FBGA (35×35) footprint supports space-constrained, high-density PCB layouts.
  • Low-voltage core compatibility: 0.87–0.93 V supply range aligns with modern low-voltage power domains.
  • Commercial temperature suitability: Rated for 0°C to 85°C operation for mainstream commercial deployments.
  • Regulatory readiness: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose 5SGXMA5K1F35C2WN?

The 5SGXMA5K1F35C2WN is positioned for designs that require a high count of programmable logic resources, significant on‑chip memory, and broad I/O capability in a compact FCBGA package. Its commercial temperature rating and documented electrical and switching characteristics from the Stratix V family make it a fit for complex digital systems where integration density and documented device behavior are priorities.

Customers building sophisticated FPGA‑based solutions can leverage the device’s dense logic and memory resources to consolidate functions, reduce external component count, and streamline board-level design while relying on Intel’s Stratix V device documentation for electrical and timing guidance.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA5K1F35C2WN.

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